Xiaopeng Qu — 25 Patents at Micron

Xiaopeng Qu has been granted 25 US patents while listed as an inventor at Micron. The first was granted in 2020 and the most recent in March 2025. Xiaopeng Qu ranks #158,593 of 4,157,543 US inventors in our database (top 3.8%). Patent records list Xiaopeng Qu in Boise, ID, US.

Issued Patents All Time

Showing 1–25 of 25 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12243801	Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same	Hyunsuk Chun, Chan H. Yoo	2025-03-04
12159811	Lidded microelectronic device packages and related systems, apparatus, and methods of manufacture	—	2024-12-03	$71,982,000
12078672	Heat spreaders for use in semiconductor device testing, such as burn-in testing	Amy R. Griffin, Wesley J. Orme	2024-09-03	$19,072,000
12028962	Thermal management of circuit boards	Hyunsuk Chun	2024-07-02	$50,597,000
12015011	Semiconductor device assemblies and systems with improved thermal performance and methods for making the same	Hyunsuk Chun	2024-06-18	$38,359,000
11984440	Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods	Shams U. Arifeen	2024-05-14	$30,364,000
11915997	Thermal management of GPU-HBM package by microchannel integrated substrate	Hyunsuk Chun, Eiichi Nakano	2024-02-27	$14,682,000
11908803	Semiconductor devices with flexible connector array	Koustav Sinha	2024-02-20	$18,735,000
11617284	Assemblies including heat dispersing elements and related systems and methods	—	2023-03-28	$13,032,000
11587918	Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods	Shams U. Arifeen	2023-02-21	$8,544,000
11557526	Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same	Hyunsuk Chun, Chan H. Yoo	2023-01-17	$11,545,000
11515171	Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices	Hyunsuk Chun, Brandon P. Wirz, Andrew M. Bayless	2022-11-29	$10,551,000
11419239	Thermal management of circuit boards	Hyunsuk Chun	2022-08-16	$9,745,000
11385281	Heat spreaders for use in semiconductor device testing, such as burn-in testing	Amy R. Griffin, Hyunsuk Chun	2022-07-12	$18,742,000
11372043	Heat spreaders for use in semiconductor device testing, such as burn-in testing	Amy R. Griffin, Wesley J. Orme	2022-06-28	$17,627,000
11348857	Lidded microelectronic device packages and related systems, apparatus, and methods of manufacture	—	2022-05-31	$17,698,000
11348875	Semiconductor devices with flexible connector array	Koustav Sinha	2022-05-31	$17,698,000
11270924	Heat spreaders for multiple semiconductor device modules	—	2022-03-08	$21,463,000
11239133	Apparatus and method for dissipating heat in multiple semiconductor device modules	Shams U. Arifeen	2022-02-01	$13,825,000
11211364	Semiconductor device assemblies and systems with improved thermal performance and methods for making the same	Hyunsuk Chun	2021-12-28	$20,140,000
11011452	Heat spreaders for semiconductor devices, and associated systems and methods	Amy R. Griffin, Hyunsuk Chun	2021-05-18	$21,936,000
11011449	Apparatus and method for dissipating heat in multiple semiconductor device modules	Shams U. Arifeen	2021-05-18	$21,936,000
10952352	Assemblies including heat dispersing elements and related systems and methods	—	2021-03-16	$22,312,000
10672679	Heat spreaders for multiple semiconductor device modules	—	2020-06-02	$19,328,000
10653033	Kits for enhanced cooling of components of computing devices and related computing devices, systems and methods	Hyunsuk Chun	2020-05-12	$18,939,000

Xiaopeng Qu — 25 Patents

Issued Patents All Time

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