Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341110 | Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices | Koustav Sinha, Quang Nguyen, Christopher Glancey | 2025-06-24 |
| 12218079 | Semiconductor devices with reinforced substrates | Koustav Sinha, Christopher Glancey | 2025-02-04 |
| 12211814 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Quang Nguyen, Christopher Glancey, Koustav Sinha, Chan H. Yoo | 2025-01-28 |
| 12211822 | Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods | Christopher Glancey, Koustav Sinha | 2025-01-28 |
| 11997782 | Thermally conductive label for circuit | Kaleb A. Wilson, Bradley R. Bitz, João Elmiro da Rocha Chaves, Mark A. Tverdy | 2024-05-28 |
| 11984440 | Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods | Xiaopeng Qu | 2024-05-14 |
| 11869862 | Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems | Christopher Glancey, Koustav Sinha | 2024-01-09 |
| 11855002 | Warpage control in microelectronic packages, and related assemblies and methods | Christopher Glancey | 2023-12-26 |
| 11848282 | Semiconductor devices having crack-inhibiting structures | Hyunsuk Chun, Sheng-Wei Yang | 2023-12-19 |
| 11769752 | Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods | Christopher Glancey, Koustav Sinha | 2023-09-26 |
| 11728307 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Quang Nguyen, Christopher Glancey, Koustav Sinha, Chan H. Yoo | 2023-08-15 |
| 11721658 | Semiconductor device packages with angled pillars for decreasing stress | — | 2023-08-08 |
| 11688658 | Semiconductor device | Hyunsuk Chun, Chan H. Yoo, Tracy N. Tennant | 2023-06-27 |
| 11664360 | Circuit board with spaces for embedding components | Quang Nguyen, Christopher Glancey, Koustav Sinha | 2023-05-30 |
| 11646286 | Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints | Christopher Glancey, Koustav Sinha, Xiao Li | 2023-05-09 |
| 11616028 | Semiconductor devices having crack-inhibiting structures | Hyunsuk Chun, Sheng-Wei Yang, Keizo Kawakita | 2023-03-28 |
| 11587918 | Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods | Xiaopeng Qu | 2023-02-21 |
| 11552029 | Semiconductor devices with reinforced substrates | Koustav Sinha, Christopher Glancey | 2023-01-10 |
| 11444037 | Semiconductor devices having crack-inhibiting structures | Hyunsuk Chun, Sheng-Wei Yang | 2022-09-13 |
| 11276659 | Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements | Christopher Glancey, Koustav Sinha | 2022-03-15 |
| 11239133 | Apparatus and method for dissipating heat in multiple semiconductor device modules | Xiaopeng Qu | 2022-02-01 |
| 11164837 | Semiconductor device packages with angled pillars for decreasing stress | — | 2021-11-02 |
| 11031353 | Warpage control in microelectronic packages, and related assemblies and methods | Christopher Glancey | 2021-06-08 |
| 11011449 | Apparatus and method for dissipating heat in multiple semiconductor device modules | Xiaopeng Qu | 2021-05-18 |
| 10811365 | Semiconductor devices having crack-inhibiting structures | Hyunsuk Chun, Sheng-Wei Yang, Keizo Kawakita | 2020-10-20 |