Issued Patents All Time
Showing 25 most recent of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12403516 | Shape processes, feedstock materials, conductive materials and/or assemblies | Glenn J. Grant, Keerti S. Kappagantula | 2025-09-02 |
| 12365027 | High speed shear-assisted extrusion | Scott A. Whalen, Jens T. Darsell, MD. Reza-E-Rabby, Brandon Scott Taysom, Tianhao Wang +1 more | 2025-07-22 |
| 12368101 | Apparatuses including interconnect structures including dielectric material surrounded by conductive material, and related memory devices | Jordan D. Greenlee, Lifang Xu, Rita J. Klein, Everett A. McTeer | 2025-07-22 |
| 12358035 | Devices and methods for performing shear-assisted extrusion and extrusion processes | Scott A. Whalen, Darrell R. Herling, MD. Reza-E-Rabby, Brandon Scott Taysom, Glenn J. Grant +3 more | 2025-07-15 |
| 12295140 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | Jordan D. Greenlee, Allen McTeer, Rita J. Klein, John D. Hopkins, Nancy M. Lomeli +7 more | 2025-05-06 |
| 12250812 | Integrated assemblies and methods of forming integrated assemblies | Jordan D. Greenlee, Nancy M. Lomeli, John D. Hopkins, Jiewei Chen, Indra V. Chary +5 more | 2025-03-11 |
| 12186791 | Devices and methods for performing shear-assisted extrusion and extrusion processes | Scott A. Whalen, Darrell R. Herling, MD. Reza-E-Rabby, Brandon Scott Taysom, Glenn J. Grant | 2025-01-07 |
| 12167604 | Integrated assemblies and methods of forming integrated assemblies | Shuangqiang Luo, Dong Wang, Rui Zhang, DA-WEI XING, Pei Qiong Cheung +1 more | 2024-12-10 |
| 12002759 | Apparatuses including a conductive contact including a dielectric material surrounded by a conductive material | Jordan D. Greenlee, Lifang Xu, Rita J. Klein, Everett A. McTeer | 2024-06-04 |
| 11982813 | Waveguides with high index materials and methods of fabrication thereof | Vikramjit Singh, Kang Luo, Michal Beau Dennison Vaughn, Samarth Bhargava, Shuqiang Yang +6 more | 2024-05-14 |
| 11978705 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | Shuangqiang Luo, Lifang Xu, Jivaan Kishore Jhothiraman, Mohadeseh Asadolahi Baboli | 2024-05-07 |
| 11889691 | Integrated assemblies and methods of forming integrated assemblies | Shuangqiang Luo, Dong Wang, Rui Zhang, DA-WEI XING, Pei Qiong Cheung +1 more | 2024-01-30 |
| 11776877 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2023-10-03 |
| 11749666 | Semiconductor die assemblies having molded underfill structures and related technology | Bradley R. Bitz | 2023-09-05 |
| 11715685 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | Shuangqiang Luo, Indra V. Chary, Nancy M. Lomeli | 2023-08-01 |
| 11688664 | Semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Jaspreet S. Gandhi | 2023-06-27 |
| 11646286 | Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints | Shams U. Arifeen, Christopher Glancey, Koustav Sinha | 2023-05-09 |
| 11600630 | Integrated assemblies and methods of forming integrated assemblies | Jordan D. Greenlee, Nancy M. Lomeli, John D. Hopkins, Jiewei Chen, Indra V. Chary +5 more | 2023-03-07 |
| 11594462 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Shijian Luo +3 more | 2023-02-28 |
| 11387369 | Semiconductor structure formation | Shen Hu, Hung-Wei Liu, Zhiqiang Xie, Corey Staller, Jeffery B. Hull +2 more | 2022-07-12 |
| 11342265 | Apparatus including a dielectric material in a central portion of a contact via, and related methods, memory devices and electronic systems | Jordan D. Greenlee, Lifang Xu, Rita J. Klein, Everett A. McTeer | 2022-05-24 |
| 10952333 | Method for stress reduction in semiconductor package via carrier | Benjamin L. McClain | 2021-03-16 |
| 10916527 | Apparatuses and methods for semiconductor die heat dissipation | Sameer S. Vadhavkar, Anilkumar Chandolu | 2021-02-09 |
| 10916487 | Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Jaspreet S. Gandhi | 2021-02-09 |
| 10861765 | Carrier removal by use of multilayer foil | James M. Derderian, Andrew M. Bayless | 2020-12-08 |