| 12403516 |
Shape processes, feedstock materials, conductive materials and/or assemblies |
Glenn J. Grant, Keerti S. Kappagantula |
2025-09-02 |
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| 12365027 |
High speed shear-assisted extrusion |
Scott A. Whalen, Jens T. Darsell, MD. Reza-E-Rabby, Brandon Scott Taysom, Tianhao Wang +1 more |
2025-07-22 |
|
| 12368101 |
Apparatuses including interconnect structures including dielectric material surrounded by conductive material, and related memory devices |
Jordan D. Greenlee, Lifang Xu, Rita J. Klein, Everett A. McTeer |
2025-07-22 |
|
| 12358035 |
Devices and methods for performing shear-assisted extrusion and extrusion processes |
Scott A. Whalen, Darrell R. Herling, MD. Reza-E-Rabby, Brandon Scott Taysom, Glenn J. Grant +3 more |
2025-07-15 |
|
| 12295140 |
Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells |
Jordan D. Greenlee, Allen McTeer, Rita J. Klein, John D. Hopkins, Nancy M. Lomeli +7 more |
2025-05-06 |
|
| 12250812 |
Integrated assemblies and methods of forming integrated assemblies |
Jordan D. Greenlee, Nancy M. Lomeli, John D. Hopkins, Jiewei Chen, Indra V. Chary +5 more |
2025-03-11 |
|
| 12186791 |
Devices and methods for performing shear-assisted extrusion and extrusion processes |
Scott A. Whalen, Darrell R. Herling, MD. Reza-E-Rabby, Brandon Scott Taysom, Glenn J. Grant |
2025-01-07 |
|
| 12167604 |
Integrated assemblies and methods of forming integrated assemblies |
Shuangqiang Luo, Dong Wang, Rui Zhang, DA-WEI XING, Pei Qiong Cheung +1 more |
2024-12-10 |
$27,965,000 |
| 12002759 |
Apparatuses including a conductive contact including a dielectric material surrounded by a conductive material |
Jordan D. Greenlee, Lifang Xu, Rita J. Klein, Everett A. McTeer |
2024-06-04 |
|
| 11982813 |
Waveguides with high index materials and methods of fabrication thereof |
Vikramjit Singh, Kang Luo, Michal Beau Dennison Vaughn, Samarth Bhargava, Shuqiang Yang +6 more |
2024-05-14 |
|
| 11978705 |
Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems |
Shuangqiang Luo, Lifang Xu, Jivaan Kishore Jhothiraman, Mohadeseh Asadolahi Baboli |
2024-05-07 |
$32,619,000 |
| 11889691 |
Integrated assemblies and methods of forming integrated assemblies |
Shuangqiang Luo, Dong Wang, Rui Zhang, DA-WEI XING, Pei Qiong Cheung +1 more |
2024-01-30 |
$12,191,000 |
| 11776877 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths |
Sameer S. Vadhavkar, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more |
2023-10-03 |
$10,230,000 |
| 11749666 |
Semiconductor die assemblies having molded underfill structures and related technology |
Bradley R. Bitz |
2023-09-05 |
$12,684,000 |
| 11715685 |
Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems |
Shuangqiang Luo, Indra V. Chary, Nancy M. Lomeli |
2023-08-01 |
$10,878,000 |
| 11688664 |
Semiconductor device assembly with through-mold cooling channel formed in encapsulant |
Bradley R. Bitz, Jaspreet S. Gandhi |
2023-06-27 |
$8,383,000 |
| 11646286 |
Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints |
Shams U. Arifeen, Christopher Glancey, Koustav Sinha |
2023-05-09 |
$19,484,000 |
| 11600630 |
Integrated assemblies and methods of forming integrated assemblies |
Jordan D. Greenlee, Nancy M. Lomeli, John D. Hopkins, Jiewei Chen, Indra V. Chary +5 more |
2023-03-07 |
$10,226,000 |
| 11594462 |
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Shijian Luo +3 more |
2023-02-28 |
$15,268,000 |
| 11387369 |
Semiconductor structure formation |
Shen Hu, Hung-Wei Liu, Zhiqiang Xie, Corey Staller, Jeffery B. Hull +2 more |
2022-07-12 |
$18,742,000 |
| 11342265 |
Apparatus including a dielectric material in a central portion of a contact via, and related methods, memory devices and electronic systems |
Jordan D. Greenlee, Lifang Xu, Rita J. Klein, Everett A. McTeer |
2022-05-24 |
$16,890,000 |
| 10952333 |
Method for stress reduction in semiconductor package via carrier |
Benjamin L. McClain |
2021-03-16 |
$22,312,000 |
| 10916487 |
Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant |
Bradley R. Bitz, Jaspreet S. Gandhi |
2021-02-09 |
$22,943,000 |
| 10916527 |
Apparatuses and methods for semiconductor die heat dissipation |
Sameer S. Vadhavkar, Anilkumar Chandolu |
2021-02-09 |
$22,943,000 |
| 10861765 |
Carrier removal by use of multilayer foil |
James M. Derderian, Andrew M. Bayless |
2020-12-08 |
$19,346,000 |
