Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087720 | Semiconductor device assembly with surface-mount die support structures | Brandon P. Wirz | 2024-09-10 |
| 12080678 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Mark E. Tuttle | 2024-09-03 |
| 11705425 | Thermocompression bond tips and related apparatus and methods | Brandon P. Wirz, Zhaohui Ma | 2023-07-18 |
| 11670612 | Method for solder bridging elimination for bulk solder C2S interconnects | Brandon P. Wirz, Jeremy E. Minnich, Zhaohui Ma | 2023-06-06 |
| 11594432 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Jeremy E. Minnich, Travis M. Jensen | 2023-02-28 |
| 11410962 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Mark E. Tuttle | 2022-08-09 |
| 11410963 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Mark E. Tuttle | 2022-08-09 |
| 11024595 | Thermocompression bond tips and related apparatus and methods | Brandon P. Wirz, Zhaohui Ma | 2021-06-01 |
| 10998208 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Jeremy E. Minnich, Travis M. Jensen | 2021-05-04 |
| 10952333 | Method for stress reduction in semiconductor package via carrier | Xiao Li | 2021-03-16 |
| 10950568 | Semiconductor device assembly with surface-mount die support structures | Brandon P. Wirz | 2021-03-16 |
| 10879195 | Method for substrate moisture NCF voiding elimination | Brandon P. Wirz, Jeremy E. Minnich | 2020-12-29 |
| 10840210 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Mark E. Tuttle | 2020-11-17 |
| 10840209 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Mark E. Tuttle | 2020-11-17 |
| 10700038 | Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool | Jeremy E. Minnich | 2020-06-30 |
| 10548230 | Method for stress reduction in semiconductor package via carrier | Xiao Li | 2020-01-28 |
| 10410891 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Jeremy E. Minnich, Travis M. Jensen | 2019-09-10 |
| 10276539 | Method for 3D ink jet TCB interconnect control | Brandon P. Wirz, C. Alexander Ernst, Jeremy E. Minnich | 2019-04-30 |
| 10090177 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Jeremy E. Minnich, Travis M. Jensen | 2018-10-02 |