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USPTO Patent Rankings Data through Dec 31, 2025
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Benjamin L. McClain — 19 Patents

Micron: 19 patents #945 of 6,374Top 15%
Boise, ID: #517 of 3,546 inventorsTop 15%
Idaho: #745 of 8,810 inventorsTop 9%
Overall (All Time): #229,345 of 4,157,543Top 6%
19 Patents All Time
Benjamin L. McClain has been granted 19 US patents while listed as an inventor at Micron. The first was granted in 2018 and the most recent in September 2024. Benjamin L. McClain ranks #229,345 of 4,157,543 US inventors in our database (top 5.5%). Patent records list Benjamin L. McClain in Boise, ID, US.

Patents per Year

Patents granted per year, 2018 to 2024Bar chart with a peak of 5 patents in 2020.peak 52018: 1 patents20182019: 2 patents20192020: 5 patents20202021: 4 patents20212022: 2 patents20222023: 3 patents20232024: 2 patents2024

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12087720 Semiconductor device assembly with surface-mount die support structures Brandon P. Wirz 2024-09-10 $19,817,000
12080678 Methods and systems for manufacturing semiconductor devices Wei Zhou, Bret K. Street, Mark E. Tuttle 2024-09-03 $19,072,000
11705425 Thermocompression bond tips and related apparatus and methods Brandon P. Wirz, Zhaohui Ma 2023-07-18 $8,312,000
11670612 Method for solder bridging elimination for bulk solder C2S interconnects Brandon P. Wirz, Jeremy E. Minnich, Zhaohui Ma 2023-06-06 $9,972,000
11594432 Cold fluid semiconductor device release during pick and place operations, and associated systems and methods Jeremy E. Minnich, Travis M. Jensen 2023-02-28 $15,268,000
11410962 Methods and systems for manufacturing semiconductor devices Wei Zhou, Bret K. Street, Mark E. Tuttle 2022-08-09 $10,590,000
11410963 Methods and systems for manufacturing semiconductor devices Wei Zhou, Bret K. Street, Mark E. Tuttle 2022-08-09 $10,590,000
11024595 Thermocompression bond tips and related apparatus and methods Brandon P. Wirz, Zhaohui Ma 2021-06-01 $25,615,000
10998208 Cold fluid semiconductor device release during pick and place operations, and associated systems and methods Jeremy E. Minnich, Travis M. Jensen 2021-05-04 $18,454,000
10952333 Method for stress reduction in semiconductor package via carrier Xiao Li 2021-03-16 $22,312,000
10950568 Semiconductor device assembly with surface-mount die support structures Brandon P. Wirz 2021-03-16 $22,312,000
10879195 Method for substrate moisture NCF voiding elimination Brandon P. Wirz, Jeremy E. Minnich 2020-12-29 $14,732,000
10840210 Methods and systems for manufacturing semiconductor devices Wei Zhou, Bret K. Street, Mark E. Tuttle 2020-11-17 $11,531,000
10840209 Methods and systems for manufacturing semiconductor devices Wei Zhou, Bret K. Street, Mark E. Tuttle 2020-11-17 $11,531,000
10700038 Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool Jeremy E. Minnich 2020-06-30 $19,511,000
10548230 Method for stress reduction in semiconductor package via carrier Xiao Li 2020-01-28 $25,254,000
10410891 Cold fluid semiconductor device release during pick and place operations, and associated systems and methods Jeremy E. Minnich, Travis M. Jensen 2019-09-10 $13,427,000
10276539 Method for 3D ink jet TCB interconnect control Brandon P. Wirz, C. Alexander Ernst, Jeremy E. Minnich 2019-04-30 $26,022,000
10090177 Cold fluid semiconductor device release during pick and place operations, and associated systems and methods Jeremy E. Minnich, Travis M. Jensen 2018-10-02 $16,577,000

Frequent Collaborators

Jeremy E. Minnich8 shared
Brandon P. Wirz7 shared
Bret K. Street5 shared
Mark E. Tuttle5 shared
Wei Zhou5 shared
Travis M. Jensen4 shared

Nearby-Ranked Inventors

Vlastimil Kunc19
Nikolaj Maj Bentsen19
Vladimir Zhukov19
Remi Geraud19
Stephen Kaes19
Adeeti V. Ullal19
Ichiro Hayashi19
Kazuhiko Ueno19
Lei S. Qi19