| 12262731 |
Cut-stem separating and baffling apparatus and primary air separation apparatus |
Zhen Wang, Shubin Jin, Peng Ji, Jianlong Zhang, Duanduan Li +3 more |
2025-04-01 |
| 12087719 |
Bond pad with micro-protrusions for direct metallic bonding |
Aibin Yu, Wei Zhou |
2024-09-10 |
| 11705425 |
Thermocompression bond tips and related apparatus and methods |
Benjamin L. McClain, Brandon P. Wirz |
2023-07-18 |
| 11670612 |
Method for solder bridging elimination for bulk solder C2S interconnects |
Brandon P. Wirz, Benjamin L. McClain, Jeremy E. Minnich |
2023-06-06 |
| 11024595 |
Thermocompression bond tips and related apparatus and methods |
Benjamin L. McClain, Brandon P. Wirz |
2021-06-01 |
| 10923448 |
Bond pad with micro-protrusions for direct metallic bonding |
Aibin Yu, Wei Zhou |
2021-02-16 |
| 10734370 |
Methods of making semiconductor devices |
Wei Zhou, Chee Chung So, Soo Loo Ang, Aibin Yu |
2020-08-04 |
| 10636678 |
Semiconductor die assemblies with heat sink and associated systems and methods |
Wei Zhou, Aibin Yu |
2020-04-28 |
| 10312226 |
Semiconductor devices comprising protected side surfaces and related methods |
Wei Zhou, Chee Chung So, Soo Loo Ang, Aibin Yu |
2019-06-04 |
| 10153178 |
Semiconductor die assemblies with heat sink and associated systems and methods |
Wei Zhou, Aibin Yu |
2018-12-11 |
| 10103134 |
Methods of manufacturing multi-die semiconductor device packages and related assemblies |
Wei Zhou, Aibin Yu, Sony Varghese, Jonathan S. Hacker, Bret K. Street +1 more |
2018-10-16 |
| 9865578 |
Methods of manufacturing multi-die semiconductor device packages and related assemblies |
Wei Zhou, Aibin Yu, Sony Varghese, Jonathan S. Hacker, Bret K. Street +1 more |
2018-01-09 |
| 9786612 |
Methods of processing wafer-level assemblies to reduce warpage, and related assemblies |
Aibin Yu, Wei Zhou, Bret K. Street |
2017-10-10 |
| 9786643 |
Semiconductor devices comprising protected side surfaces and related methods |
Wei Zhou, Chee Chung So, Soo Loo Ang, Aibin Yu |
2017-10-10 |
| 9716019 |
Semiconductor die assemblies with heat sink and associated systems and methods |
Wei Zhou, Aibin Yu |
2017-07-25 |
| 9589933 |
Methods of processing wafer-level assemblies to reduce warpage, and related assemblies |
Aibin Yu, Wei Zhou, Bret K. Street |
2017-03-07 |
| 9349670 |
Semiconductor die assemblies with heat sink and associated systems and methods |
Wei Zhou, Aibin Yu |
2016-05-24 |
| 9337064 |
Methods of protecting peripheries of in-process semiconductor wafers and related in-process wafers and systems |
Wei Zhou, Aibin Yu |
2016-05-10 |
| 9202714 |
Methods for forming semiconductor device packages |
Wei Zhou, Aibin Yu |
2015-12-01 |
