Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12262731 | Cut-stem separating and baffling apparatus and primary air separation apparatus | Zhen Wang, Shubin Jin, Peng Ji, Jianlong Zhang, Duanduan Li +3 more | 2025-04-01 |
| 12087719 | Bond pad with micro-protrusions for direct metallic bonding | Aibin Yu, Wei Zhou | 2024-09-10 |
| 11705425 | Thermocompression bond tips and related apparatus and methods | Benjamin L. McClain, Brandon P. Wirz | 2023-07-18 |
| 11670612 | Method for solder bridging elimination for bulk solder C2S interconnects | Brandon P. Wirz, Benjamin L. McClain, Jeremy E. Minnich | 2023-06-06 |
| 11024595 | Thermocompression bond tips and related apparatus and methods | Benjamin L. McClain, Brandon P. Wirz | 2021-06-01 |
| 10923448 | Bond pad with micro-protrusions for direct metallic bonding | Aibin Yu, Wei Zhou | 2021-02-16 |
| 10734370 | Methods of making semiconductor devices | Wei Zhou, Chee Chung So, Soo Loo Ang, Aibin Yu | 2020-08-04 |
| 10636678 | Semiconductor die assemblies with heat sink and associated systems and methods | Wei Zhou, Aibin Yu | 2020-04-28 |
| 10312226 | Semiconductor devices comprising protected side surfaces and related methods | Wei Zhou, Chee Chung So, Soo Loo Ang, Aibin Yu | 2019-06-04 |
| 10153178 | Semiconductor die assemblies with heat sink and associated systems and methods | Wei Zhou, Aibin Yu | 2018-12-11 |
| 10103134 | Methods of manufacturing multi-die semiconductor device packages and related assemblies | Wei Zhou, Aibin Yu, Sony Varghese, Jonathan S. Hacker, Bret K. Street +1 more | 2018-10-16 |
| 9865578 | Methods of manufacturing multi-die semiconductor device packages and related assemblies | Wei Zhou, Aibin Yu, Sony Varghese, Jonathan S. Hacker, Bret K. Street +1 more | 2018-01-09 |
| 9786612 | Methods of processing wafer-level assemblies to reduce warpage, and related assemblies | Aibin Yu, Wei Zhou, Bret K. Street | 2017-10-10 |
| 9786643 | Semiconductor devices comprising protected side surfaces and related methods | Wei Zhou, Chee Chung So, Soo Loo Ang, Aibin Yu | 2017-10-10 |
| 9716019 | Semiconductor die assemblies with heat sink and associated systems and methods | Wei Zhou, Aibin Yu | 2017-07-25 |
| 9589933 | Methods of processing wafer-level assemblies to reduce warpage, and related assemblies | Aibin Yu, Wei Zhou, Bret K. Street | 2017-03-07 |
| 9349670 | Semiconductor die assemblies with heat sink and associated systems and methods | Wei Zhou, Aibin Yu | 2016-05-24 |
| 9337064 | Methods of protecting peripheries of in-process semiconductor wafers and related in-process wafers and systems | Wei Zhou, Aibin Yu | 2016-05-10 |
| 9202714 | Methods for forming semiconductor device packages | Wei Zhou, Aibin Yu | 2015-12-01 |