| 11955346 |
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods |
Shijian Luo |
2024-04-09 |
$33,276,000 |
| 11923329 |
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology |
— |
2024-03-05 |
|
| 11565371 |
Systems and methods for forming semiconductor cutting/trimming blades |
— |
2023-01-31 |
$12,340,000 |
| 11527505 |
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology |
— |
2022-12-13 |
$12,619,000 |
| 11402426 |
Inductive testing probe apparatus for testing semiconductor die and related systems and methods |
Tony M. Lindenberg, Kurt J. Bossart, Chandra S. Tiwari |
2022-08-02 |
$10,849,000 |
| 11302653 |
Die features for self-alignment during die bonding |
Bret K. Street, Wei Zhou, Christopher J. Gambee, Shijian Luo |
2022-04-12 |
$14,807,000 |
| 11094684 |
Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography |
Chandra S. Tiwari, Tony M. Lindenberg, Christopher J. Gambee, Kurt J. Bossart |
2021-08-17 |
$19,603,000 |
| 11004697 |
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods |
Shijian Luo |
2021-05-11 |
$21,304,000 |
| 10896886 |
Semiconductor devices having discretely located passivation material, and associated systems and methods |
Mayukhee Das, Christopher J. Gambee, Chandra S. Tiwari |
2021-01-19 |
$23,715,000 |
| 10852344 |
Inductive testing probe apparatus for testing semiconductor die and related systems and methods |
Tony M. Lindenberg, Kurt J. Bossart, Chandra S. Tiwari |
2020-12-01 |
$14,926,000 |
| 10847486 |
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology |
— |
2020-11-24 |
$15,546,000 |
| 10763131 |
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods |
Shijian Luo |
2020-09-01 |
$15,473,000 |
| 10748857 |
Die features for self-alignment during die bonding |
Bret K. Street, Wei Zhou, Christopher J. Gambee, Shijian Luo |
2020-08-18 |
$12,880,000 |
| 10622223 |
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods |
Shijian Luo |
2020-04-14 |
$17,667,000 |
| 10446431 |
Temporary carrier debond initiation, and associated systems and methods |
— |
2019-10-15 |
$10,153,000 |
| 10403618 |
Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography |
Chandra S. Tiwari, Tony M. Lindenberg, Christopher J. Gambee, Kurt J. Bossart |
2019-09-03 |
$15,753,000 |
| 10396052 |
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology |
— |
2019-08-27 |
$14,447,000 |
| 10262961 |
Semiconductor devices having discretely located passivation material, and associated systems and methods |
Mayukhee Das, Christopher J. Gambee, Chandra S. Tiwari |
2019-04-16 |
$25,657,000 |
| 10103134 |
Methods of manufacturing multi-die semiconductor device packages and related assemblies |
Wei Zhou, Aibin Yu, Zhaohui Ma, Sony Varghese, Bret K. Street +1 more |
2018-10-16 |
|
| 10002840 |
Semiconductor devices having discretely located passivation material, and associated systems and methods |
Mayukhee Das, Christopher J. Gambee, Chandra S. Tiwari |
2018-06-19 |
$76,488,000 |
| 9905527 |
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology |
— |
2018-02-27 |
$42,129,000 |
| 9865578 |
Methods of manufacturing multi-die semiconductor device packages and related assemblies |
Wei Zhou, Aibin Yu, Zhaohui Ma, Sony Varghese, Bret K. Street +1 more |
2018-01-09 |
$25,985,000 |
| 7798674 |
Cover device for compact flourescent lamps |
Gary Colin Bernhardt, Wojciech Pawelko, Michael Fusco, Michael A. Savona |
2010-09-21 |
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