Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955346 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Shijian Luo | 2024-04-09 |
| 11923329 | Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology | — | 2024-03-05 |
| 11565371 | Systems and methods for forming semiconductor cutting/trimming blades | — | 2023-01-31 |
| 11527505 | Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology | — | 2022-12-13 |
| 11402426 | Inductive testing probe apparatus for testing semiconductor die and related systems and methods | Tony M. Lindenberg, Kurt J. Bossart, Chandra S. Tiwari | 2022-08-02 |
| 11302653 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Christopher J. Gambee, Shijian Luo | 2022-04-12 |
| 11094684 | Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography | Chandra S. Tiwari, Tony M. Lindenberg, Christopher J. Gambee, Kurt J. Bossart | 2021-08-17 |
| 11004697 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Shijian Luo | 2021-05-11 |
| 10896886 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Christopher J. Gambee, Chandra S. Tiwari | 2021-01-19 |
| 10852344 | Inductive testing probe apparatus for testing semiconductor die and related systems and methods | Tony M. Lindenberg, Kurt J. Bossart, Chandra S. Tiwari | 2020-12-01 |
| 10847486 | Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology | — | 2020-11-24 |
| 10763131 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Shijian Luo | 2020-09-01 |
| 10748857 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Christopher J. Gambee, Shijian Luo | 2020-08-18 |
| 10622223 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Shijian Luo | 2020-04-14 |
| 10446431 | Temporary carrier debond initiation, and associated systems and methods | — | 2019-10-15 |
| 10403618 | Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography | Chandra S. Tiwari, Tony M. Lindenberg, Christopher J. Gambee, Kurt J. Bossart | 2019-09-03 |
| 10396052 | Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology | — | 2019-08-27 |
| 10262961 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Christopher J. Gambee, Chandra S. Tiwari | 2019-04-16 |
| 10103134 | Methods of manufacturing multi-die semiconductor device packages and related assemblies | Wei Zhou, Aibin Yu, Zhaohui Ma, Sony Varghese, Bret K. Street +1 more | 2018-10-16 |
| 10002840 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Christopher J. Gambee, Chandra S. Tiwari | 2018-06-19 |
| 9905527 | Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology | — | 2018-02-27 |
| 9865578 | Methods of manufacturing multi-die semiconductor device packages and related assemblies | Wei Zhou, Aibin Yu, Zhaohui Ma, Sony Varghese, Bret K. Street +1 more | 2018-01-09 |
| 7798674 | Cover device for compact flourescent lamps | Gary Colin Bernhardt, Wojciech Pawelko, Michael Fusco, Michael A. Savona | 2010-09-21 |