Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406886 | Microelectronic devices including slot structures, and related electronic systems and methods of forming the microelectronic devices | David A. Kewley, Deep Panjwani, Matthew Holland, Matthew J. King, Michael E. Koltonski +3 more | 2025-09-02 |
| 12324154 | Microelectronic devices including pillars with partially-circular upper portions and circular lower portions, and related methods | Matthew J. King, David Daycock, Yoshiaki Fukuzumi, Albert Fayrushin, Richard J. Hill +1 more | 2025-06-03 |
| 12279431 | Integrated assemblies and methods of forming integrated assemblies | Ramey M. Abdelrahaman, Jeslin J. Wu, Kunal Shrotri, Swapnil Lengade | 2025-04-15 |
| 12205900 | Electronic devices comprising a compressive dielectric material, and related systems and methods | Jivaan Kishore Jhothiraman, Rutuparna Narulkar | 2025-01-21 |
| 12069856 | Methods of forming electronic devices using materials removable at different temperatures | Kunal Shrotri | 2024-08-20 |
| 12063783 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Xiaosong Zhang, Yi Hu, Tom J. John, Wei Yeeng Ng | 2024-08-13 |
| 11800717 | Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systems | Matthew J. King, David Daycock, Yoshiaki Fukuzumi, Albert Fayrushin, Richard J. Hill +1 more | 2023-10-24 |
| 11706924 | Integrated assemblies and methods of forming integrated assemblies | Ramey M. Abdelrahaman, Jeslin J. Wu, Kunal Shrotri, Swapnil Lengade | 2023-07-18 |
| 11700729 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Yi Hu, Ramey M. Abdelrahaman, Narula Bilik, Daniel Billingsley, Zhenyu Bo +9 more | 2023-07-11 |
| 11626423 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Xiaosong Zhang, Yi Hu, Tom J. John, Wei Yeeng Ng | 2023-04-11 |
| 11476268 | Methods of forming electronic devices using materials removable at different temperatures | Kunal Shrotri | 2022-10-18 |
| 11444093 | Memory arrays and methods of forming memory arrays | — | 2022-09-13 |
| 11402426 | Inductive testing probe apparatus for testing semiconductor die and related systems and methods | Tony M. Lindenberg, Kurt J. Bossart, Jonathan S. Hacker | 2022-08-02 |
| 11329064 | Integrated assemblies and methods of forming integrated assemblies | Ramey M. Abdelrahaman, Jeslin J. Wu, Kunal Shrotri, Swapnil Lengade | 2022-05-10 |
| 11322516 | Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systems | Matthew J. King, David Daycock, Yoshiaki Fukuzumi, Albert Fayrushin, Richard J. Hill +1 more | 2022-05-03 |
| 11302712 | Integrated circuitry, memory arrays comprising strings of memory cells, methods used in forming integrated circuitry, and methods used in forming a memory array comprising strings of memory cells | Jivaan Kishore Jhothiraman | 2022-04-12 |
| 11276658 | Devices with three-dimensional structures and support elements to increase adhesion to substrates | Christopher J. Gambee, Nhi Doan, Owen R. Fay, Ying Chen | 2022-03-15 |
| 11205654 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Yi Hu, Ramey M. Abdelrahaman, Narula Bilik, Daniel Billingsley, Zhenyu Bo +9 more | 2021-12-21 |
| 11094684 | Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography | Tony M. Lindenberg, Jonathan S. Hacker, Christopher J. Gambee, Kurt J. Bossart | 2021-08-17 |
| 11075219 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Xiaosong Zhang, Yi Hu, Tom J. John, Wei Yeeng Ng | 2021-07-27 |
| 10896886 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Jonathan S. Hacker, Christopher J. Gambee | 2021-01-19 |
| 10852344 | Inductive testing probe apparatus for testing semiconductor die and related systems and methods | Tony M. Lindenberg, Kurt J. Bossart, Jonathan S. Hacker | 2020-12-01 |
| 10790251 | Methods for enhancing adhesion of three-dimensional structures to substrates | Christopher J. Gambee, Nhi Doan, Owen R. Fay, Ying Chen | 2020-09-29 |
| 10403618 | Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography | Tony M. Lindenberg, Jonathan S. Hacker, Christopher J. Gambee, Kurt J. Bossart | 2019-09-03 |
| 10262961 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Jonathan S. Hacker, Christopher J. Gambee | 2019-04-16 |