Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302653 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Jonathan S. Hacker, Shijian Luo | 2022-04-12 |
| 11276658 | Devices with three-dimensional structures and support elements to increase adhesion to substrates | Nhi Doan, Chandra S. Tiwari, Owen R. Fay, Ying Chen | 2022-03-15 |
| 11094684 | Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography | Chandra S. Tiwari, Tony M. Lindenberg, Jonathan S. Hacker, Kurt J. Bossart | 2021-08-17 |
| 10923478 | Reduction of roughness on a sidewall of an opening | Devesh Dadhich Shreeram, Irina Vasilyeva | 2021-02-16 |
| 10896886 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Jonathan S. Hacker, Chandra S. Tiwari | 2021-01-19 |
| 10811313 | Methods of fabricating conductive traces and resulting structures | — | 2020-10-20 |
| 10790251 | Methods for enhancing adhesion of three-dimensional structures to substrates | Nhi Doan, Chandra S. Tiwari, Owen R. Fay, Ying Chen | 2020-09-29 |
| 10748857 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Jonathan S. Hacker, Shijian Luo | 2020-08-18 |
| 10403618 | Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography | Chandra S. Tiwari, Tony M. Lindenberg, Jonathan S. Hacker, Kurt J. Bossart | 2019-09-03 |
| 10332792 | Methods of fabricating conductive traces and resulting structures | — | 2019-06-25 |
| 10262961 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Jonathan S. Hacker, Chandra S. Tiwari | 2019-04-16 |
| 10002840 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Jonathan S. Hacker, Chandra S. Tiwari | 2018-06-19 |
| 9966347 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Brandon P. Wirz, Jaspreet S. Gandhi, Satish Yeldandi | 2018-05-08 |
| 9741612 | Semiconductor devices and methods for backside photo alignment | Brandon P. Wirz, Keith E. Ypma, Jaspreet S. Gandhi, Kevin M. Dowdle, Irina Vasilyeva +2 more | 2017-08-22 |
| 9704781 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Brandon P. Wirz, Jaspreet S. Gandhi, Satish Yeldandi | 2017-07-11 |
| 9318438 | Semiconductor structures comprising at least one through-substrate via filled with conductive materials | Mark Bossler, Jaspreet S. Gandhi, Randall S. Parker | 2016-04-19 |
| 9299663 | Semiconductor devices and methods for backside photo alignment | Brandon P. Wirz, Keith E. Ypma, Jaspreet S. Gandhi, Kevin M. Dowdle, Irina Vasilyeva +2 more | 2016-03-29 |
| 9129869 | Pillar on pad interconnect structures, semiconductor devices including same and related methods | Owen R. Fay, Luke England | 2015-09-08 |
| 9034769 | Methods of selectively removing a substrate material | Mark Bossler, Jaspreet S. Gandhi, Randall S. Parker | 2015-05-19 |
| 8659153 | Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods | Owen R. Fay, Luke England | 2014-02-25 |
| 8470710 | Methods of forming a metal pattern | G. Alan VonKrosigk | 2013-06-25 |
| 8329580 | Methods of forming a metal pattern and semiconductor device structure | G. Alan VonKrosigk | 2012-12-11 |
| 8008196 | Method to create a metal pattern using a damascene-like process | G. Alan VonKrosigk | 2011-08-30 |
| 7402908 | Intermediate semiconductor device structures | G. Alan VonKrosigk | 2008-07-22 |