| 11302653 |
Die features for self-alignment during die bonding |
Bret K. Street, Wei Zhou, Jonathan S. Hacker, Shijian Luo |
2022-04-12 |
$14,807,000 |
| 11276658 |
Devices with three-dimensional structures and support elements to increase adhesion to substrates |
Nhi Doan, Chandra S. Tiwari, Owen R. Fay, Ying Chen |
2022-03-15 |
$16,938,000 |
| 11094684 |
Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography |
Chandra S. Tiwari, Tony M. Lindenberg, Jonathan S. Hacker, Kurt J. Bossart |
2021-08-17 |
$19,603,000 |
| 10923478 |
Reduction of roughness on a sidewall of an opening |
Devesh Dadhich Shreeram, Irina Vasilyeva |
2021-02-16 |
$25,890,000 |
| 10896886 |
Semiconductor devices having discretely located passivation material, and associated systems and methods |
Mayukhee Das, Jonathan S. Hacker, Chandra S. Tiwari |
2021-01-19 |
$23,715,000 |
| 10811313 |
Methods of fabricating conductive traces and resulting structures |
— |
2020-10-20 |
$20,299,000 |
| 10790251 |
Methods for enhancing adhesion of three-dimensional structures to substrates |
Nhi Doan, Chandra S. Tiwari, Owen R. Fay, Ying Chen |
2020-09-29 |
$16,991,000 |
| 10748857 |
Die features for self-alignment during die bonding |
Bret K. Street, Wei Zhou, Jonathan S. Hacker, Shijian Luo |
2020-08-18 |
$12,880,000 |
| 10403618 |
Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography |
Chandra S. Tiwari, Tony M. Lindenberg, Jonathan S. Hacker, Kurt J. Bossart |
2019-09-03 |
$15,753,000 |
| 10332792 |
Methods of fabricating conductive traces and resulting structures |
— |
2019-06-25 |
$15,739,000 |
| 10262961 |
Semiconductor devices having discretely located passivation material, and associated systems and methods |
Mayukhee Das, Jonathan S. Hacker, Chandra S. Tiwari |
2019-04-16 |
$25,657,000 |
| 10002840 |
Semiconductor devices having discretely located passivation material, and associated systems and methods |
Mayukhee Das, Jonathan S. Hacker, Chandra S. Tiwari |
2018-06-19 |
$76,488,000 |
| 9966347 |
Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods |
Brandon P. Wirz, Jaspreet S. Gandhi, Satish Yeldandi |
2018-05-08 |
$83,924,000 |
| 9741612 |
Semiconductor devices and methods for backside photo alignment |
Brandon P. Wirz, Keith E. Ypma, Jaspreet S. Gandhi, Kevin M. Dowdle, Irina Vasilyeva +2 more |
2017-08-22 |
$10,704,000 |
| 9704781 |
Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods |
Brandon P. Wirz, Jaspreet S. Gandhi, Satish Yeldandi |
2017-07-11 |
$14,665,000 |
| 9318438 |
Semiconductor structures comprising at least one through-substrate via filled with conductive materials |
Mark Bossler, Jaspreet S. Gandhi, Randall S. Parker |
2016-04-19 |
$6,825,000 |
| 9299663 |
Semiconductor devices and methods for backside photo alignment |
Brandon P. Wirz, Keith E. Ypma, Jaspreet S. Gandhi, Kevin M. Dowdle, Irina Vasilyeva +2 more |
2016-03-29 |
$6,502,000 |
| 9129869 |
Pillar on pad interconnect structures, semiconductor devices including same and related methods |
Owen R. Fay, Luke England |
2015-09-08 |
$8,072,000 |
| 9034769 |
Methods of selectively removing a substrate material |
Mark Bossler, Jaspreet S. Gandhi, Randall S. Parker |
2015-05-19 |
$14,126,000 |
| 8659153 |
Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods |
Owen R. Fay, Luke England |
2014-02-25 |
$15,509,000 |
| 8470710 |
Methods of forming a metal pattern |
G. Alan VonKrosigk |
2013-06-25 |
$5,511,000 |
| 8329580 |
Methods of forming a metal pattern and semiconductor device structure |
G. Alan VonKrosigk |
2012-12-11 |
$3,231,000 |
| 8008196 |
Method to create a metal pattern using a damascene-like process |
G. Alan VonKrosigk |
2011-08-30 |
$3,768,000 |
| 7402908 |
Intermediate semiconductor device structures |
G. Alan VonKrosigk |
2008-07-22 |
$1,260,000 |
