Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966347 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Brandon P. Wirz, Jaspreet S. Gandhi, Christopher J. Gambee | 2018-05-08 |
| 9704781 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Brandon P. Wirz, Jaspreet S. Gandhi, Christopher J. Gambee | 2017-07-11 |