Issued Patents All Time
Showing 1–25 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400877 | Semiconductor devices with flexible reinforcement structure | Chan H. Yoo | 2025-08-26 |
| 12394750 | Semiconductor assemblies with redistribution structures for die stack signal routing | Madison E. Wale, James L. Voelz, Dylan W. Southern, Dustin L. Holloway | 2025-08-19 |
| 12277056 | Memory device interface and method | Brent Keeth, Chan H. Yoo, Roy Greeff, Matthew B. Leslie | 2025-04-15 |
| 12272870 | Tunable integrated millimeter wave antenna using laser ablation and/or fuses | John F. Kaeding | 2025-04-08 |
| 12253943 | Memory device interface and method | Brent Keeth, Chan H. Yoo, Roy Greeff, Matthew B. Leslie | 2025-03-18 |
| 12230583 | Interposers for microelectronic devices | Chan H. Yoo | 2025-02-18 |
| 12218119 | Stacked interposer structures | Chan H. Yoo | 2025-02-04 |
| 12218101 | Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same | Chan H. Yoo, Mark E. Tuttle | 2025-02-04 |
| 12199001 | Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same | Chan H. Yoo | 2025-01-14 |
| 12199068 | Methods of forming microelectronic device assemblies and packages | Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo, Bret K. Street +2 more | 2025-01-14 |
| 12191162 | Semiconductor device assembly with pillar array | Akshay N. Singh, Kyle K. Kirby | 2025-01-07 |
| 12170275 | Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer | Chan H. Yoo | 2024-12-17 |
| 12148711 | Semiconductor packages and associated methods with antennas and EMI isolation shields | Dong Soon Lim, Randon K. Richards, Aparna U. Limaye | 2024-11-19 |
| 12062607 | Low cost three-dimensional stacking semiconductor assemblies | Chan H. Yoo | 2024-08-13 |
| 12051670 | Use of pre-channeled materials for anisotropic conductors | Mark E. Tuttle, John F. Kaeding, Eiichi Nakano, Shijian Luo | 2024-07-30 |
| 12033929 | Package-on-package semiconductor assemblies and methods of manufacturing the same | Jack E. Murray | 2024-07-09 |
| 12027498 | Three-dimensional stacking semiconductor assemblies with near zero bond line thickness | — | 2024-07-02 |
| 11990446 | Semiconductor assemblies with redistribution structures for die stack signal routing | Madison E. Wale, James L. Voelz, Dylan W. Southern, Dustin L. Holloway | 2024-05-21 |
| 11990350 | Semiconductor devices with flexible reinforcement structure | Chan H. Yoo | 2024-05-21 |
| 11973062 | High density pillar interconnect conversion with stack to substrate connection | Kyle K. Kirby, Akshay N. Singh | 2024-04-30 |
| 11961825 | Microelectronic device assemblies and packages including multiple device stacks and related methods | Aparna U. Limaye, Dong Soon Lim, Randon K. Richards | 2024-04-16 |
| 11948921 | Methods of forming stacked semiconductors die assemblies | Randon K. Richards, Aparna U. Limaye, Dong Soon Lim | 2024-04-02 |
| 11908814 | Fabricated two-sided millimeter wave antenna using through-silicon-vias | John F. Kaeding | 2024-02-20 |
| 11868253 | Memory device interface and method | Brent Keeth, Chan H. Yoo, Roy Greeff, Matthew B. Leslie | 2024-01-09 |
| 11848299 | Edge-notched substrate packaging and associated systems and methods | Madison E. Wale, James L. Voelz, Dylan W. Southern | 2023-12-19 |