| 12506118 |
Perpendicular semiconductor device assemblies and associated methods |
Brandon P. Wirz, Andrew M. Bayless, Bang-Ning Hsu |
2025-12-23 |
|
| 12494444 |
Semiconductor device with tunable antenna using wire bonds |
Shaolong Luo |
2025-12-09 |
|
| 12400877 |
Semiconductor devices with flexible reinforcement structure |
Chan H. Yoo |
2025-08-26 |
|
| 12394750 |
Semiconductor assemblies with redistribution structures for die stack signal routing |
Madison E. Wale, James L. Voelz, Dylan W. Southern, Dustin L. Holloway |
2025-08-19 |
|
| 12277056 |
Memory device interface and method |
Brent Keeth, Chan H. Yoo, Roy Greeff, Matthew B. Leslie |
2025-04-15 |
|
| 12272870 |
Tunable integrated millimeter wave antenna using laser ablation and/or fuses |
John F. Kaeding |
2025-04-08 |
|
| 12253943 |
Memory device interface and method |
Brent Keeth, Chan H. Yoo, Roy Greeff, Matthew B. Leslie |
2025-03-18 |
|
| 12230583 |
Interposers for microelectronic devices |
Chan H. Yoo |
2025-02-18 |
|
| 12218119 |
Stacked interposer structures |
Chan H. Yoo |
2025-02-04 |
|
| 12218101 |
Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same |
Chan H. Yoo, Mark E. Tuttle |
2025-02-04 |
|
| 12199068 |
Methods of forming microelectronic device assemblies and packages |
Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo, Bret K. Street +2 more |
2025-01-14 |
|
| 12199001 |
Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same |
Chan H. Yoo |
2025-01-14 |
|
| 12191162 |
Semiconductor device assembly with pillar array |
Akshay N. Singh, Kyle K. Kirby |
2025-01-07 |
|
| 12170275 |
Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer |
Chan H. Yoo |
2024-12-17 |
$47,790,000 |
| 12148711 |
Semiconductor packages and associated methods with antennas and EMI isolation shields |
Dong Soon Lim, Randon K. Richards, Aparna U. Limaye |
2024-11-19 |
|
| 12062607 |
Low cost three-dimensional stacking semiconductor assemblies |
Chan H. Yoo |
2024-08-13 |
$56,175,000 |
| 12051670 |
Use of pre-channeled materials for anisotropic conductors |
Mark E. Tuttle, John F. Kaeding, Eiichi Nakano, Shijian Luo |
2024-07-30 |
$28,317,000 |
| 12033929 |
Package-on-package semiconductor assemblies and methods of manufacturing the same |
Jack E. Murray |
2024-07-09 |
|
| 12027498 |
Three-dimensional stacking semiconductor assemblies with near zero bond line thickness |
— |
2024-07-02 |
$50,597,000 |
| 11990446 |
Semiconductor assemblies with redistribution structures for die stack signal routing |
Madison E. Wale, James L. Voelz, Dylan W. Southern, Dustin L. Holloway |
2024-05-21 |
$36,516,000 |
| 11990350 |
Semiconductor devices with flexible reinforcement structure |
Chan H. Yoo |
2024-05-21 |
$36,516,000 |
| 11973062 |
High density pillar interconnect conversion with stack to substrate connection |
Kyle K. Kirby, Akshay N. Singh |
2024-04-30 |
$40,502,000 |
| 11961825 |
Microelectronic device assemblies and packages including multiple device stacks and related methods |
Aparna U. Limaye, Dong Soon Lim, Randon K. Richards |
2024-04-16 |
$24,030,000 |
| 11948921 |
Methods of forming stacked semiconductors die assemblies |
Randon K. Richards, Aparna U. Limaye, Dong Soon Lim |
2024-04-02 |
|
| 11908814 |
Fabricated two-sided millimeter wave antenna using through-silicon-vias |
John F. Kaeding |
2024-02-20 |
$18,735,000 |
