Issued Patents All Time
Showing 51–75 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276658 | Devices with three-dimensional structures and support elements to increase adhesion to substrates | Christopher J. Gambee, Nhi Doan, Chandra S. Tiwari, Ying Chen | 2022-03-15 |
| 11264332 | Interposers for microelectronic devices | Chan H. Yoo | 2022-03-01 |
| 11251516 | Semiconductor device with tunable antenna using wire bonds | Shijian Luo | 2022-02-15 |
| 11239129 | Package cooling by coil cavity | Andrew M. Bayless, Wayne H. Huang | 2022-02-01 |
| 11196142 | Millimeter wave antenna and EMI shielding integrated with fan-out package | — | 2021-12-07 |
| 11177222 | Semiconductor packages and associated methods with antennas and EMI isolation shields | Dong Soon Lim, Randon K. Richards, Aparna U. Limaye | 2021-11-16 |
| 11171118 | Semiconductor assemblies including thermal circuits and methods of manufacturing the same | Chan H. Yoo, Eiichi Nakano | 2021-11-09 |
| 11139262 | Use of pre-channeled materials for anisotropic conductors | Mark E. Tuttle, John F. Kaeding, Eiichi Nakano, Shijian Luo | 2021-10-05 |
| 11139229 | Package-on-package semiconductor assemblies and methods of manufacturing the same | Jack E. Murray | 2021-10-05 |
| 11088114 | High density pillar interconnect conversion with stack to substrate connection | Kyle K. Kirby, Akshay N. Singh | 2021-08-10 |
| 11081783 | Integrated antenna using through silicon vias | — | 2021-08-03 |
| 11081460 | Methods and systems for manufacturing pillar structures on semiconductor devices | Suresh Yeruva, Sameer S. Vadhavkar, Adriel Jebin Jacob Jebaraj, Wayne H. Huang | 2021-08-03 |
| 11018098 | Fabricated two-sided millimeter wave antenna using through-silicon-vias | John F. Kaeding | 2021-05-25 |
| 11018056 | Encapsulated solder TSV insertion interconnect | Kyle K. Kirby | 2021-05-25 |
| 10998271 | High density pillar interconnect conversion with stack to substrate connection | Kyle K. Kirby, Akshay N. Singh | 2021-05-04 |
| 10950565 | Interconnect structures for preventing solder bridging, and associated systems and methods | Kyle S. Mayer | 2021-03-16 |
| 10943794 | Semiconductor device assembly with pillar array and test ability | Akshay N. Singh, Kyle K. Kirby | 2021-03-09 |
| 10872835 | Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same | Chan H. Yoo | 2020-12-22 |
| 10847479 | Antenna formation by integrated metal layer or redistribution layer | — | 2020-11-24 |
| 10840229 | Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer | Chan H. Yoo | 2020-11-17 |
| 10790251 | Methods for enhancing adhesion of three-dimensional structures to substrates | Christopher J. Gambee, Nhi Doan, Chandra S. Tiwari, Ying Chen | 2020-09-29 |
| 10784224 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Kyle K. Kirby, Sameer S. Vadhavkar | 2020-09-22 |
| 10770398 | Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer | Chan H. Yoo | 2020-09-08 |
| 10763186 | Package cooling by coil cavity | Andrew M. Bayless, Wayne H. Huang | 2020-09-01 |
| 10741460 | Methods for forming interconnect assemblies with probed bond pads | Kyle K. Kirby, Luke England, Jaspreet S. Gandhi | 2020-08-11 |