Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
JM

Jack E. Murray — 10 Patents

Micron: 7 patents #1,911 of 6,374Top 30%
Boise, ID: #797 of 3,546 inventorsTop 25%
Idaho: #1,292 of 8,810 inventorsTop 15%
Overall (All Time): #481,000 of 4,157,543Top 15%
10 Patents All Time
Jack E. Murray has been granted 10 US patents while listed as an inventor at Micron. The first was granted in 2001 and the most recent in July 2024. Jack E. Murray ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Jack E. Murray in Boise, ID, US.

Patents per Year

Patents granted per year, 2001 to 2024Bar chart with a peak of 2 patents in 2019.peak 22001: 1 patents20012016: 1 patents20162018: 1 patents20182019: 2 patents20192020: 2 patents20202021: 1 patents20212023: 1 patents20232024: 1 patents2024

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12033929 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2024-07-09
11791252 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2023-10-17
11139229 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2021-10-05 $16,233,000
10825761 Electronic devices having tapered edge walls Brandon P. Wirz 2020-11-03 $12,106,000
10825762 Methods of processing semiconductor devices Brandon P. Wirz 2020-11-03 $12,106,000
10381297 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2019-08-13 $12,593,000
10276479 Methods of processing semiconductor devices Brandon P. Wirz 2019-04-30 $26,022,000
10032703 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2018-07-24 $67,799,000
9418926 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2016-08-16 $10,478,000
6227076 Shaft wrench 2001-05-08