Issued Patents All Time
Showing 101–108 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7425464 | Semiconductor device packaging | Kevin R. Lish, Douglas G. Mitchell | 2008-09-16 |
| 7078796 | Corrosion-resistant copper bond pad and integrated device | Gregory J. Dunn, Timothy B. Dean, Terance B. Blake, Remy J. Chelini, William H. Lytle +1 more | 2006-07-18 |
| 7015075 | Die encapsulation using a porous carrier | Craig Amrine, Kevin R. Lish | 2006-03-21 |
| 6953985 | Wafer level MEMS packaging | Jong-Kai Lin, William H. Lytle, Steven Markgraf, Henry G. Hughes, Craig Amrine +1 more | 2005-10-11 |
| 6949398 | Low cost fabrication and assembly of lid for semiconductor devices | William H. Lytle, Steven Markgraf, Stephen Springer | 2005-09-27 |
| 6930032 | Under bump metallurgy structural design for high reliability bumped packages | Vijay Sarihan, Lizabeth Keser | 2005-08-16 |
| 6780751 | Method for eliminating voiding in plated solder | — | 2004-08-24 |
| 6362089 | Method for processing a semiconductor substrate having a copper surface disposed thereon and structure formed | Jaynal A. Molla | 2002-03-26 |