Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6953985 | Wafer level MEMS packaging | Jong-Kai Lin, William H. Lytle, Owen R. Fay, Steven Markgraf, Craig Amrine +1 more | 2005-10-11 |
| 6514789 | Component and method for manufacture | Heidi L. Denton, Thor D. Osborn, Daxue Xu | 2003-02-04 |
| 6465281 | Method of manufacturing a semiconductor wafer level package | Daxue Xu, Paul L. Bergstrom, Frank A. Shemansky, Jr., Hak-Yam Tsoi | 2002-10-15 |
| 6326228 | Sensor and method of fabrication | Marilyn J. Stuckey, Margaret L. Kniffin, Ping Lue | 2001-12-04 |
| 6274515 | Spin-on dielectric formation process for use in manufacturing semiconductors | Ping Lue | 2001-08-14 |
| 6013933 | Semiconductor structure having a monocrystalline member overlying a cavity in a semiconductor substrate and process therefor | Juergen A. Foerstner, Amir Mirza | 2000-01-11 |
| 5948361 | Chemical sensor and method of making same | Frank T. Secco D'Aragona, Lionel Lescouzeres, Jean-Paul Guillemet | 1999-09-07 |
| 5898101 | Method of operating chemical sensors | Robert P. Lyle | 1999-04-27 |
| 5804462 | Method for forming a multiple-sensor semiconductor chip | Chung-Chiun Liu, Xiaodong Wang | 1998-09-08 |
| 5798556 | Sensor and method of fabrication | Marilyn J. Stuckey, Margret L. Kniffin, Ping Lue | 1998-08-25 |
| 5693545 | Method for forming a semiconductor sensor FET device | Young Sir Chung, Keenan L. Evans, Ronald J. Gutteridge | 1997-12-02 |
| 5591676 | Method of making a semiconductor device having a low permittivity dielectric | Ping Lue, Frederick J. Robinson | 1997-01-07 |
| 5545912 | Electronic device enclosure including a conductive cap and substrate | Ljubisa Ristic, Daniel N. Koury, Jr., John E. Schmiesing, Ronald J. Gutteridge | 1996-08-13 |
| 5457879 | Method of shaping inter-substrate plug and receptacles interconnects | Richard W. Gurtler | 1995-10-17 |
| 5442237 | Semiconductor device having a low permittivity dielectric | Ping Lue, Frederick J. Robinson | 1995-08-15 |
| 5323051 | Semiconductor wafer level package | Victor J. Adams, Paul T. Bennett, Brooks L. Scofield, Jr., Marilyn J. Stuckey | 1994-06-21 |
| 5256581 | Silicon film with improved thickness control | Juergen A. Foerstner, Frank S. d'Aragona | 1993-10-26 |
| 5207866 | Anisotropic single crystal silicon etching solution and method | Ping Lue | 1993-05-04 |
| 4801560 | Semiconductor processing utilizing carbon containing thick film spin-on glass | Thomas E. Wood | 1989-01-31 |
| 4798629 | Spin-on glass for use in semiconductor processing | Thomas E. Wood | 1989-01-17 |
| 4717641 | Method for passivating a semiconductor junction | Emanuel Belmont | 1988-01-05 |
| 4241165 | Plasma development process for photoresist | Jed Keller | 1980-12-23 |