Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9142434 | Method for singulating electronic components from a substrate | Wei Gao, Craig Amrine, Zhiwei Gong, Scott M. Hayes, Lizabeth Keser +1 more | 2015-09-22 |
| 9107303 | Warp compensated electronic assemblies | Scott M. Hayes, George R. Leal | 2015-08-11 |
| 8829661 | Warp compensated package and method | Scott M. Hayes, George R. Leal | 2014-09-09 |
| 8415203 | Method of forming a semiconductor package including two devices | Kenneth R. Burch, Marc Alan Mangrum | 2013-04-09 |
| 8327532 | Method for releasing a microelectronic assembly from a carrier substrate | Jianwen Xu, Scott M. Hayes | 2012-12-11 |
| 7969026 | Flexible carrier for high volume electronic package fabrication | Craig Amrine | 2011-06-28 |
| 7838420 | Method for forming a packaged semiconductor device | Jinbang Tang, Darrel R. Frear | 2010-11-23 |
| 7820485 | Method of forming a package with exposed component surfaces | — | 2010-10-26 |
| 7802359 | Electronic assembly manufacturing method | Craig Amrine | 2010-09-28 |
| 7741151 | Integrated circuit package formation | Craig Amrine | 2010-06-22 |
| 7595226 | Method of packaging an integrated circuit die | Owen R. Fay, Jianwen Xu | 2009-09-29 |
| 7442581 | Flexible carrier and release method for high volume electronic package fabrication | Craig Amrine | 2008-10-28 |
| 7078796 | Corrosion-resistant copper bond pad and integrated device | Gregory J. Dunn, Owen R. Fay, Timothy B. Dean, Terance B. Blake, Remy J. Chelini +1 more | 2006-07-18 |
| 6974776 | Activation plate for electroless and immersion plating of integrated circuits | Timothy B. Dean | 2005-12-13 |
| 6953985 | Wafer level MEMS packaging | Jong-Kai Lin, Owen R. Fay, Steven Markgraf, Henry G. Hughes, Craig Amrine +1 more | 2005-10-11 |
| 6949398 | Low cost fabrication and assembly of lid for semiconductor devices | Owen R. Fay, Steven Markgraf, Stephen Springer | 2005-09-27 |
| 6302775 | Apparatus and method for cold cross-sectioning of soft materials | Russell T. Lee | 2001-10-16 |
| 5912510 | Bonding structure for an electronic device | Lih-Tyng Hwang | 1999-06-15 |
| 5674780 | Method of forming an electrically conductive polymer bump over an aluminum electrode | Treliant Fang, Jong-Kai Lin, Ravinder K. Sharma, Naresh Saha | 1997-10-07 |
| 5593903 | Method of forming contact pads for wafer level testing and burn-in of semiconductor dice | William M. Beckenbaugh, Bernard H. Berman | 1997-01-14 |
| 5587342 | Method of forming an electrical interconnect | Jong-Kai Lin, Ravichandran Subrahmanyan | 1996-12-24 |
| 5411400 | Interconnect system for a semiconductor chip and a substrate | Ravichandran Subrahmanyan, Ravinder K. Sharma, Barry C. Johnson | 1995-05-02 |
| 5409567 | Method of etching copper layers | Kevin Chang, Peter Charles East | 1995-04-25 |
| 5391285 | Adjustable plating cell for uniform bump plating of semiconductor wafers | Tien-Yu Lee, Bennett L. Hileman | 1995-02-21 |
| 5072873 | Device for solder removal | Jay Liu, Thomas A. Scharr | 1991-12-17 |