Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832394 | Sensing decal | Jonathan Sharif Marx Stark | 2023-11-28 |
| 11385114 | Force detecting sensor | Richard McConnell | 2022-07-12 |
| 11234333 | Sensing decal | Jonathan Sharif Marx Stark | 2022-01-25 |
| 5848466 | Method for forming a microelectronic assembly | Daniel Joseph Viza, Dennis Brian Miller, Conrad S. Monroe, Kent W. Hansen | 1998-12-15 |
| 5593903 | Method of forming contact pads for wafer level testing and burn-in of semiconductor dice | William H. Lytle, Bernard H. Berman | 1997-01-14 |
| 5429292 | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties | Cynthia M. Melton, Dennis Brian Miller | 1995-07-04 |
| 5389160 | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties | Cynthia M. Melton, Dennis Brian Miller | 1995-02-14 |
| 5377027 | Liquid crystal display device with pixel registration illumination | Kevin W. Jelley, George Valliath | 1994-12-27 |
| 5229070 | Low temperature-wetting tin-base solder paste | Cynthia M. Melton, Andrew Skipor | 1993-07-20 |
| 5194137 | Solder plate reflow method for forming solder-bumped terminals | Kevin D. Moore, John W. Stafford, Ken Cholewczynski | 1993-03-16 |
| 5160409 | Solder plate reflow method for forming a solder bump on a circuit trace intersection | Kevin D. Moore, John W. Stafford, Ken Cholewczynski | 1992-11-03 |
| 5086966 | Palladium-coated solder ball | Cynthia M. Melton, Carl Raleigh, Steven Scheifers | 1992-02-11 |
| 4304849 | Methods of depositing metallic copper on substrates | Theodore D. Polakowski, Jr., Donald Dinella, Patricia J. Goldman | 1981-12-08 |
| 4268536 | Method for depositing a metal on a surface | Patricia J. Goldman, Ted D. Polakowski, Jr. | 1981-05-19 |
| 4261800 | Method of selectively depositing a metal on a surface of a substrate | Michael Anthony De Angelo | 1981-04-14 |
| 4228213 | Method of depositing a stress-free electroless copper deposit | Kim L. Morton | 1980-10-14 |
| 4181750 | Method of depositing a metal on a surface | Patricia J. Goldman, Kim L. Morton | 1980-01-01 |