Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6200829 | Microelectronic assembly with connection to a buried electrical element, and method for forming same | Grace M. O'Malley, Brian R. Kemper | 2001-03-13 |
| 5898215 | Microelectronic assembly with connection to a buried electrical element, and method for forming same | Grace M. O'Malley, Brian R. Kemper | 1999-04-27 |
| 5856912 | Microelectronic assembly for connection to an embedded electrical element, and method for forming same | Grace M. O'Malley, Brian R. Kemper | 1999-01-05 |
| 5848466 | Method for forming a microelectronic assembly | Daniel Joseph Viza, William M. Beckenbaugh, Conrad S. Monroe, Kent W. Hansen | 1998-12-15 |
| 5829668 | Method for forming solder bumps on bond pads | Reed A. George | 1998-11-03 |
| 5749614 | Vacuum pickup tool for placing balls in a customized pattern | Ellen Margaret Reid, Douglas Bruce Feicht, Daniel Joseph Viza, Mark McGarry | 1998-05-12 |
| 5429292 | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties | Cynthia M. Melton, William M. Beckenbaugh | 1995-07-04 |
| 5389160 | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties | Cynthia M. Melton, William M. Beckenbaugh | 1995-02-14 |
| 5325451 | Modular optical waveguide and method for making | Davis H. Hartman, Michael S. Lebby, Thomas H. Blair | 1994-06-28 |
| 5120678 | Electrical component package comprising polymer-reinforced solder bump interconnection | Kevin D. Moore, Steven C. Machuga, John W. Stafford, Kenneth Cholewczynski | 1992-06-09 |