Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10843817 | Systems and methods for recovering and controlling post-recovery motion of unmanned aircraft | Robert Gilchrist, III, Brian D. Dennis, Allen Smith, Jaime Mack, Steven M. Sliwa +2 more | 2020-11-24 |
| 9944408 | Systems and methods for recovering and controlling post-recovery motion of unmanned aircraft | Robert Gilchrist, III, Brian D. Dennis, Allen Smith, Jaime Mack, Steven M. Sliwa +2 more | 2018-04-17 |
| 9004402 | Method and apparatus for automated launch, retrieval, and servicing of a hovering aircraft | Brian T. McGeer, Robert Joseph Heavey, III, Damon Lucas McMillan | 2015-04-14 |
| 8573536 | Method and apparatus for automated launch, retrieval, and servicing of a hovering aircraft | Brian T. McGeer, Robert Joseph Heavey, III, Damon Lucas McMillan | 2013-11-05 |
| 7125176 | PCB with embedded optical fiber | George G. Grouch, Irka Zazulak | 2006-10-24 |
| 5905750 | Semiconductor laser package and method of fabrication | Michael S. Lebby, Wenbin Jiang | 1999-05-18 |
| 5892661 | Smartcard and method of making | Theodore G. Tessier, David Jandzinski | 1999-04-06 |
| 5838703 | Semiconductor laser package with power monitoring system and optical element | Michael S. Lebby, Wenbin Jiang | 1998-11-17 |
| 5816478 | Fluxless flip-chip bond and a method for making | Kenneth Kaskoun, David Jandzinski | 1998-10-06 |
| 5818404 | Integrated electro-optical package | Michael S. Lebby, Fred V. Richard | 1998-10-06 |
| 5789815 | Three dimensional semiconductor package having flexible appendages | Theodore G. Tessier, David Jandzinski | 1998-08-04 |
| 5739800 | Integrated electro-optical package with LED display chip and substrate with drivers and central opening | Michael S. Lebby, Fred V. Richard | 1998-04-14 |
| 5699073 | Integrated electro-optical package with carrier ring and method of fabrication | Michael S. Lebby, Fred V. Richard | 1997-12-16 |
| 5689279 | Integrated electro-optical package | Ronald J. Nelson | 1997-11-18 |
| 5650640 | Integrated electro-optic package | Thomas B. Harvey, III, Franky So | 1997-07-22 |
| 5627931 | Optoelectronic transducer | Donald E. Ackley | 1997-05-06 |
| 5612549 | Integrated electro-optical package | Ronald J. Nelson, Thomas B. Harvey, III | 1997-03-18 |
| 5602491 | Integrated circuit testing board having constrained thermal expansion characteristics | Barbara Vasquez, William Williams, III | 1997-02-11 |
| 5446247 | Electrical contact and method for making an electrical contact | Lubomir Cergel, Barry C. Johnson | 1995-08-29 |
| 5432358 | Integrated electro-optical package | Ronald J. Nelson | 1995-07-11 |
| 5221426 | Laser etch-back process for forming a metal feature on a non-metal substrate | Theodore G. Tessier, William F. Hoffman | 1993-06-22 |
| 5217597 | Solder bump transfer method | Kevin D. Moore, Mauro Walker | 1993-06-08 |
| 5194137 | Solder plate reflow method for forming solder-bumped terminals | Kevin D. Moore, William M. Beckenbaugh, Ken Cholewczynski | 1993-03-16 |
| 5160409 | Solder plate reflow method for forming a solder bump on a circuit trace intersection | Kevin D. Moore, William M. Beckenbaugh, Ken Cholewczynski | 1992-11-03 |
| 5120678 | Electrical component package comprising polymer-reinforced solder bump interconnection | Kevin D. Moore, Steven C. Machuga, Kenneth Cholewczynski, Dennis Brian Miller | 1992-06-09 |