Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12401143 | High-current electrical pass through standoff connection for electronic box | Patrick Su, Alan Kang | 2025-08-26 |
| 11729926 | Electronics device having a plastic cover with a sealed center boss | Patrick Su | 2023-08-15 |
| 11509078 | Compliant pin structure for discrete electrical components | Patrick Su | 2022-11-22 |
| 11456547 | Headerless harness connection assembly and methods of constructing and utilizing same | Patrick Su | 2022-09-27 |
| 11191171 | Electronics device having a plastic cover with a sealed center boss | Patrick Su, Ravi Kiran Kothamasa | 2021-11-30 |
| 11089705 | Electronics device having a plastic cover with a sealed center boss | Patrick Su | 2021-08-10 |
| 10729027 | Method and structure for limiting cover deflection in an ECU with leakage testing feature | Patrick Su, Ravi Kiran Kothamasa, Leonardo Ramon Haoava Salazar | 2020-07-28 |
| 10314189 | Electronics module enclosure | James G. Godwin | 2019-06-04 |
| 10159157 | Compliant PCB-to-housing fastener | Patrick Su | 2018-12-18 |
| 9961786 | Method and structure for limiting cover deflection in an ECU when exposed to high altitude environments | Ravi Kiran Kothamasa | 2018-05-01 |
| 9107310 | Electronics module | James G. Godwin, Patrick Su | 2015-08-11 |
| 7300820 | Adhesive assembly for a circuit board | Jinbao Jiao, Thomas P. Gall, William Weigler | 2007-11-27 |
| 7075794 | Electronic control unit | Thomas P. Gall, Timothy J. Trento | 2006-07-11 |
| 6927344 | Flexible circuit board assembly | Thomas P. Gall, Richard A. Hawkins | 2005-08-09 |
| 6841739 | Flexible circuit board having electrical resistance heater trace | — | 2005-01-11 |
| 6501661 | Electronic control unit | Thomas P. Gall, Jeffrey D. Lord | 2002-12-31 |
| 6483037 | Multilayer flexible FR4 circuit | Thomas P. Gall | 2002-11-19 |
| 5327013 | Solder bumping of integrated circuit die | Carl Missele | 1994-07-05 |
| 5281684 | Solder bumping of integrated circuit die | Carl Missele | 1994-01-25 |
| 5269453 | Low temperature method for forming solder bump interconnections to a plated circuit trace | Cynthia M. Melton, Kenneth Cholewczynski, Carl Raleigh | 1993-12-14 |
| 5217597 | Solder bump transfer method | John W. Stafford, Mauro Walker | 1993-06-08 |
| 5194137 | Solder plate reflow method for forming solder-bumped terminals | John W. Stafford, William M. Beckenbaugh, Ken Cholewczynski | 1993-03-16 |
| 5186383 | Method for forming solder bump interconnections to a solder-plated circuit trace | Cynthia M. Melton, Carl Raleigh, Kenneth Cholewczynski | 1993-02-16 |
| 5160409 | Solder plate reflow method for forming a solder bump on a circuit trace intersection | John W. Stafford, William M. Beckenbaugh, Ken Cholewczynski | 1992-11-03 |
| 5148968 | Solder bump stretch device | Detlef Schmidt, Carl Mussele | 1992-09-22 |