Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7353983 | Vertical removal of excess solder from a circuit substrate | Robert Babula, James E. Herbold, Thomas P. Gall, Steven G. Sharkey | 2008-04-08 |
| 7300820 | Adhesive assembly for a circuit board | Jinbao Jiao, Kevin D. Moore, Thomas P. Gall | 2007-11-27 |
| 5224022 | Reroute strategy for high density substrates | Gregory E. Pitts | 1993-06-29 |
| 5220490 | Substrate interconnect allowing personalization using spot surface links | Lawrence N. Smith | 1993-06-15 |