Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Reroute strategy for high density substrates

Reroute strategy for high density substrates

US Patent 5224022 · Granted Jun 29, 1993

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vertical removal of excess solder from a circuit substrate2008
Adhesive assembly for a circuit board2007
Substrate interconnect allowing personalization using spot surface links1993
Apparatus for replacing defective electronic components1991
Method for replacing defective electronic components1991
Single point bonding method and apparatus1988