Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5269453 | Low temperature method for forming solder bump interconnections to a plated circuit trace | Cynthia M. Melton, Kevin D. Moore, Carl Raleigh | 1993-12-14 |
| 5186383 | Method for forming solder bump interconnections to a solder-plated circuit trace | Cynthia M. Melton, Carl Raleigh, Kevin D. Moore | 1993-02-16 |
| 5120678 | Electrical component package comprising polymer-reinforced solder bump interconnection | Kevin D. Moore, Steven C. Machuga, John W. Stafford, Dennis Brian Miller | 1992-06-09 |