Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436730 | Microelectronic package comprising tin copper solder bump interconnections and method for forming same | Theresa L. Baker | 2002-08-20 |
| 6194250 | Low-profile microelectronic package | George N. Demet, Iwona Turlik | 2001-02-27 |
| 6093972 | Microelectronic package including a polymer encapsulated die | Francis J. Carney, George Amos Carson, Phillip Celaya, Harry Fuerhaupter, Frank Tim Jones +3 more | 2000-07-25 |
| 5895229 | Microelectronic package including a polymer encapsulated die, and method for forming same | Francis J. Carney, George Amos Carson, Phillip Celaya, Harry Fuerhaupter, Frank Tim Jones +3 more | 1999-04-20 |
| 5844315 | Low-profile microelectronic package | George N. Demet, Iwona Turlik | 1998-12-01 |
| 5814401 | Selectively filled adhesive film containing a fluxing agent | Daniel Gamota, Robert W. Pennisi | 1998-09-29 |
| 5597110 | Method for forming a solder bump by solder-jetting or the like | Robert C. Pfahl, Jr. | 1997-01-28 |
| 5452842 | Tin-zinc solder connection to a printed circuit board or the like | Linda Weitzel | 1995-09-26 |
| 5435838 | Immersion plating of tin-bismuth solder | Alicia Growney, Harry Fuerhaupter | 1995-07-25 |
| 5429292 | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties | William M. Beckenbaugh, Dennis Brian Miller | 1995-07-04 |
| 5410184 | Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same | Theresa L. Baker | 1995-04-25 |
| 5391402 | Immersion plating of tin-bismuth solder | Alicia Growney, Harry Fuerhaupter | 1995-02-21 |
| 5390080 | Tin-zinc solder connection to a printed circuit board of the like | Linda Weitzel | 1995-02-14 |
| 5389160 | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties | William M. Beckenbaugh, Dennis Brian Miller | 1995-02-14 |
| 5320272 | Tin-bismuth solder connection having improved high temperature properties, and process for forming same | Harry Fuerhaupter, George N. Demet | 1994-06-14 |
| 5316205 | Method for forming gold bump connection using tin-bismuth solder | — | 1994-05-31 |
| 5282565 | Solder bump interconnection formed using spaced solder deposit and consumable path | — | 1994-02-01 |
| 5269453 | Low temperature method for forming solder bump interconnections to a plated circuit trace | Kenneth Cholewczynski, Kevin D. Moore, Carl Raleigh | 1993-12-14 |
| 5233504 | Noncollapsing multisolder interconnection | Carl Raleigh, Steven Scheifers | 1993-08-03 |
| 5229070 | Low temperature-wetting tin-base solder paste | Andrew Skipor, William M. Beckenbaugh | 1993-07-20 |
| 5221038 | Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature | Andrew Skipor | 1993-06-22 |
| 5186383 | Method for forming solder bump interconnections to a solder-plated circuit trace | Carl Raleigh, Kenneth Cholewczynski, Kevin D. Moore | 1993-02-16 |
| 5154341 | Noncollapsing multisolder interconnection | Carl Raleigh, Steven Scheifers | 1992-10-13 |
| 5086966 | Palladium-coated solder ball | Carl Raleigh, Steven Scheifers, William M. Beckenbaugh | 1992-02-11 |