Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436730 | Microelectronic package comprising tin copper solder bump interconnections and method for forming same | Cynthia M. Melton | 2002-08-20 |
| 6030684 | Protecting electronic components in acidic and basic environment | Anthony J. Polak | 2000-02-29 |
| 5686162 | Protecting electronic components in acidic and basic environments | Anthony J. Polak | 1997-11-11 |
| 5410184 | Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same | Cynthia M. Melton | 1995-04-25 |