Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379048 | Dual-flag stacked die package | Phillip Celaya | 2016-06-28 |
| 8384206 | Semiconductor package | Stephen St. Germain, Roger M. Arbuthnot | 2013-02-26 |
| 7935575 | Method of forming a semiconductor package and structure therefor | Stephen St. Germain, Roger M. Arbuthnot | 2011-05-03 |
| 6093972 | Microelectronic package including a polymer encapsulated die | Francis J. Carney, George Amos Carson, Phillip Celaya, Harry Fuerhaupter, Donald H. Klosterman +3 more | 2000-07-25 |
| 5895229 | Microelectronic package including a polymer encapsulated die, and method for forming same | Francis J. Carney, George Amos Carson, Phillip Celaya, Harry Fuerhaupter, Donald H. Klosterman +3 more | 1999-04-20 |
| 4468411 | Method for providing alpha particle protection for an integrated circuit die | James W. Sloan, Truoc T. Tran | 1984-08-28 |