Issued Patents All Time
Showing 25 most recent of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417957 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Roger M. Arbuthnot | 2025-09-16 |
| 12362266 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2025-07-15 |
| 12355009 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2025-07-08 |
| 12347755 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2025-07-01 |
| 12347812 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2025-07-01 |
| 11984388 | Semiconductor package structures and methods of manufacture | Jay A. Yoder, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya | 2024-05-14 |
| 11955412 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2024-04-09 |
| 11948870 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2024-04-02 |
| 11908840 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2024-02-20 |
| 11894347 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2024-02-06 |
| 11881398 | Semiconductor device and method for supporting ultra-thin semiconductor die | Gordon M. Grivna | 2024-01-23 |
| 11842942 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Roger M. Arbuthnot | 2023-12-12 |
| 11710686 | Semiconductor package structures and methods of manufacture | Jay A. Yoder, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya | 2023-07-25 |
| 11521928 | Reducing stress cracks in substrates | Yong Liu | 2022-12-06 |
| 11469163 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2022-10-11 |
| 11462515 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2022-10-04 |
| 11355341 | Semiconductor device and method for supporting ultra-thin semiconductor die | Gordon M. Grivna | 2022-06-07 |
| 11282764 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Roger M. Arbuthnot | 2022-03-22 |
| 11217515 | Semiconductor package structures and methods of manufacture | Jay A. Yoder, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya | 2022-01-04 |
| 11107753 | Packaging structure for gallium nitride devices | Roger M. Arbuthnot, David P. Billings, Andrew Celaya | 2021-08-31 |
| 10672607 | Semiconductor device and method for supporting ultra-thin semiconductor die | Gordon M. Grivna | 2020-06-02 |
| 10522448 | Single or multi chip module package and related methods | Roger M. Arbuthnot, Jay A. Yoder, Dennis Lee Conner | 2019-12-31 |
| 10490488 | Semiconductor devices and methods of making the same | Roger M. Arbuthnot | 2019-11-26 |
| 10325835 | Semiconductor devices and methods of making the same | Roger M. Arbuthnot | 2019-06-18 |
| 10090199 | Semiconductor device and method for supporting ultra-thin semiconductor die | Gordon M. Grivna | 2018-10-02 |