| 11984388 |
Semiconductor package structures and methods of manufacture |
Stephen St. Germain, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya |
2024-05-14 |
$24,866,000 |
| 11710686 |
Semiconductor package structures and methods of manufacture |
Stephen St. Germain, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya |
2023-07-25 |
$105,230,000 |
| 11217515 |
Semiconductor package structures and methods of manufacture |
Stephen St. Germain, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya |
2022-01-04 |
$68,504,000 |
| 10522448 |
Single or multi chip module package and related methods |
Stephen St. Germain, Roger M. Arbuthnot, Dennis Lee Conner |
2019-12-31 |
$14,074,000 |
| 9911684 |
Holes and dimples to control solder flow |
Stephen St. Germain, Dennis Lee Conner |
2018-03-06 |
$7,454,000 |
| 9870986 |
Single or multi chip module package and related methods |
Stephen St. Germain, Roger M. Arbuthnot, Dennis Lee Conner |
2018-01-16 |
$23,010,000 |
| 9847219 |
Semiconductor die singulation method |
William F. Burghout, Dennis Lee Conner, Michael J. Seddon, Gordon M. Grivna |
2017-12-19 |
$6,131,000 |
| 9558968 |
Single or multi chip module package and related methods |
Stephen St. Germain, Roger M. Arbuthnot, Dennis Lee Conner |
2017-01-31 |
$13,205,000 |
| 9484210 |
Semiconductor die singulation method |
William F. Burghout, Dennis Lee Conner, Michael J. Seddon, Gordon M. Grivna |
2016-11-01 |
$7,141,000 |
| 9034733 |
Semiconductor die singulation method |
William F. Burghout, Dennis Lee Conner, Michael J. Seddon, Gordon M. Grivna |
2015-05-19 |
$5,416,000 |
| 8664089 |
Semiconductor die singulation method |
William F. Burghout, Dennis Lee Conner, Michael J. Seddon |
2014-03-04 |
$9,000,000 |
| 8574961 |
Method of marking a low profile packaged semiconductor device |
James H. Knapp, Harold Anderson |
2013-11-05 |
$9,902,000 |
| 8319323 |
Electronic package having down-set leads and method |
James P. Letterman, Jr., Joseph K. Fauty, William F. Burghout |
2012-11-27 |
$23,106,000 |
| 8253239 |
Multi-chip semiconductor connector |
Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain |
2012-08-28 |
$4,890,000 |
| 7875964 |
Multi-chip semiconductor connector and method |
Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain |
2011-01-25 |
$10,101,000 |
| 7820528 |
Method of forming a leaded molded array package |
William F. Burghout, Francis J. Carney, Joseph K. Fauty, James P. Letterman, Jr. |
2010-10-26 |
$4,473,000 |
| 7598123 |
Semiconductor component and method of manufacture |
Joseph K. Fauty, James P. Letterman, Jr. |
2009-10-06 |
$48,936,000 |
| 7588999 |
Method of forming a leaded molded array package |
William F. Burghout, Francis J. Carney, Joseph K. Fauty, James P. Letterman, Jr. |
2009-09-15 |
$13,755,000 |
| 7508060 |
Multi-chip semiconductor connector assemblies |
Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen Germain |
2009-03-24 |
$9,831,000 |
| 7498195 |
Multi-chip semiconductor connector assembly method |
Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain |
2009-03-03 |
$24,087,000 |
| 7298034 |
Multi-chip semiconductor connector assemblies |
Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain |
2007-11-20 |
$8,174,000 |
| 7202106 |
Multi-chip semiconductor connector and method |
Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain |
2007-04-10 |
$14,662,000 |
| 7202105 |
Multi-chip semiconductor connector assembly method |
Francis J. Carney, Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain |
2007-04-10 |
$14,662,000 |
| 6768186 |
Semiconductor device and laminated leadframe package |
James P. Letterman, Jr., Joseph K. Fauty |
2004-07-27 |
$14,519,000 |