Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8574961 | Method of marking a low profile packaged semiconductor device | Jay A. Yoder, Harold Anderson | 2013-11-05 |
| 7227240 | Semiconductor device with wire bond inductor and method | Francis J. Carney, Harold Anderson, Yenting Wen, Cang Ngo | 2007-06-05 |
| 7109064 | Method of forming a semiconductor package and leadframe therefor | Joseph K. Fauty, James P. Letterman, Jr. | 2006-09-19 |
| 6835580 | Direct chip attach structure and method | Kok Yang LAU, Beng L. Lim, Guan Keng Quah | 2004-12-28 |
| 6833290 | Structure and method of forming a multiple leadframe semiconductor device | Stephen St. Germain | 2004-12-21 |
| 6747341 | Integrated circuit and laminated leadframe package | Stephen St. Germain | 2004-06-08 |
| 6713317 | Semiconductor device and laminated leadframe package | Stephen St. Germain | 2004-03-30 |
| 6677672 | Structure and method of forming a multiple leadframe semiconductor device | Stephen St. Germain | 2004-01-13 |
| 6300679 | Flexible substrate for packaging a semiconductor component | Prosanto K. Mukerji, Ronald E. Thomas, George W. Hawkins, Rajesh Srinivasan, Colin B. Bosch +2 more | 2001-10-09 |
| 6116791 | Optical coupler and method for coupling an optical fiber to an optoelectric device | Albert J. Laninga, Laura J. Norton, Joseph E. Sauvageau | 2000-09-12 |
| 6093972 | Microelectronic package including a polymer encapsulated die | Francis J. Carney, George Amos Carson, Phillip Celaya, Harry Fuerhaupter, Frank Tim Jones +3 more | 2000-07-25 |
| 6081031 | Semiconductor package consisting of multiple conductive layers | James P. Letterman, Jr., Albert J. Laninga, Joseph K. Fauty, William F. Burghout | 2000-06-27 |
| 5973337 | Ball grid device with optically transmissive coating | Dwight L. Daniels, Keith E. Nelson, Brian A. Webb | 1999-10-26 |
| 5933558 | Optoelectronic device and method of assembly | Joseph E. Sauvageau, Francis J. Carney, Laura J. Norton | 1999-08-03 |
| 5928595 | Method of manufacturing a semiconductor component | Cliff J. Scribner, Albert J. Laninga | 1999-07-27 |
| 5900669 | Semiconductor component | Keith E. Nelson, Les Ticey, Kevin J. Foley | 1999-05-04 |
| 5895229 | Microelectronic package including a polymer encapsulated die, and method for forming same | Francis J. Carney, George Amos Carson, Phillip Celaya, Harry Fuerhaupter, Frank Tim Jones +3 more | 1999-04-20 |
| 5883996 | Electronic component for aligning a light transmitting structure | Francis J. Carney, Laura J. Norton | 1999-03-16 |
| 5834062 | Material transfer apparatus and method of using the same | Timothy L. Johnson, Albert J. Laninga | 1998-11-10 |
| 5768456 | Optoelectronic package including photonic device mounted in flexible substrate | Barbara Foley | 1998-06-16 |
| 5761364 | Optical waveguide | Laura J. Norton, Joseph E. Sauvageau | 1998-06-02 |
| 5659648 | Polyimide optical waveguide having electrical conductivity | Francis J. Carney | 1997-08-19 |
| 5637264 | Method of fabricating an optical waveguide | Laura J. Norton, Michael L. Majercak, Michael C. Majercak | 1997-06-10 |
| 5529682 | Method for making semiconductor devices having electroplated leads | Francis J. Carney | 1996-06-25 |
| 5468910 | Semiconductor device package and method of making | Keith E. Nelson | 1995-11-21 |