| 11417598 |
Semiconductor package and related methods |
Yusheng LIN, George Chang |
2022-08-16 |
| 10811598 |
Current sensor packages |
Jefferson W. Hall, Michael J. Seddon |
2020-10-20 |
| 10651124 |
Semiconductor package and related methods |
Yusheng LIN, George Chang |
2020-05-12 |
| 10573803 |
Current sensor packages with through hole in semiconductor |
Jefferson W. Hall, Michael J. Seddon |
2020-02-25 |
| 10396028 |
Semiconductor package and related methods |
Yusheng LIN, George Chang |
2019-08-27 |
| 9984968 |
Semiconductor package and related methods |
Yusheng LIN, George Chang |
2018-05-29 |
| 9941257 |
Embedded stacked die packages and related methods |
Yusheng LIN, Francis J. Carney, Chee Hiong CHEW, Azhar Aripin |
2018-04-10 |
| 9679878 |
Embedded stacked die packages and related methods |
Yusheng LIN, Francis J. Carney, Chee Hiong CHEW, Azhar Aripin |
2017-06-13 |
| 9373600 |
Package substrate structure for enhanced signal transmission and method |
— |
2016-06-21 |
| 8999807 |
Method for manufacturing a semiconductor component that includes a common mode choke and structure |
Li Jiang, Ryan Hurley, Sudhama C. Shastri, Wang-Chang Albert Gu, Phillip Holland +3 more |
2015-04-07 |
| 8582317 |
Method for manufacturing a semiconductor component and structure therefor |
Kisun Lee, Michael A. Stapleton, Gary H. Loechelt |
2013-11-12 |
| 7589392 |
Filter having integrated floating capacitor and transient voltage suppression structure and method of manufacture |
Sudhama C. Shastri, Ryan Hurley, David M. Heminger, Mark A. Thomas |
2009-09-15 |
| 7579670 |
Integrated filter having ground plane structure |
Sudhama C. Shastri |
2009-08-25 |
| 7466212 |
Semiconductor filter structure and method of manufacture |
Sudhama C. Shastri, Ryan Hurley, Emily M. Linehan, Mark A. Thomas, Earl D. Fuchs |
2008-12-16 |
| 7227240 |
Semiconductor device with wire bond inductor and method |
James H. Knapp, Francis J. Carney, Harold Anderson, Cang Ngo |
2007-06-05 |