Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10546798 | Direct bonded copper semiconductor packages and related methods | Erik Nino Tolentino, Vernal Raja Manikam | 2020-01-28 |
| 9941257 | Embedded stacked die packages and related methods | Yusheng LIN, Francis J. Carney, Yenting Wen, Chee Hiong CHEW | 2018-04-10 |
| 9768091 | Method of forming an electronic package and structure | — | 2017-09-19 |
| 9679878 | Embedded stacked die packages and related methods | Yusheng LIN, Francis J. Carney, Yenting Wen, Chee Hiong CHEW | 2017-06-13 |
| 9659837 | Direct bonded copper semiconductor packages and related methods | Erik Nino Tolentino, Vemal Raja Manikam | 2017-05-23 |
| 7482679 | Leadframe for a semiconductor device | Norsaidi Sariyo | 2009-01-27 |
| 7211466 | Stacked die semiconductor device | Wai Yew Lo, Kong Bee Tiu | 2007-05-01 |
| 6885093 | Stacked die semiconductor device | Wai Yew Lo, Kong Bee Tiu | 2005-04-26 |