Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991185 | Direct bonded copper semiconductor packages and related methods | Erik Nino Tolentino, Azhair Aripin | 2018-06-05 |
| 9659837 | Direct bonded copper semiconductor packages and related methods | Erik Nino Tolentino, Azhar Aripin | 2017-05-23 |
| 8338828 | Semiconductor package and method of testing same | Boon Yew Low, Teck Beng Lau | 2012-12-25 |
| 8237293 | Semiconductor package with protective tape | Tzu Ling Wong, Boon Yew Low, Vittal Raja Manikam | 2012-08-07 |
| 7989965 | Underfill dispensing system for integrated circuits | Vittal Raja Manikam, Yit Meng Lee | 2011-08-02 |