Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984408 | Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation | You Ge, Zhijie Wang, Mariano Layson Ching, Jr. | 2024-05-14 |
| 10734327 | Lead reduction for improved creepage distance | Mariano Layson Ching, Jr., Burton J. Carpenter, Jinmei Liu, Allen Marfil Descartin | 2020-08-04 |
| 7989965 | Underfill dispensing system for integrated circuits | Vittal Raja Manikam, Vemal Raja Manikam | 2011-08-02 |