| 12051642 |
QFN semiconductor package, semiconductor package and lead frame |
Zhijie Wang, Meng Kong Lye |
2024-07-30 |
| 11984408 |
Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation |
Zhijie Wang, Yit Meng Lee, Mariano Layson Ching, Jr. |
2024-05-14 |
| 11515238 |
Power die package |
Meng Kong Lye, Zhijie Wang, Kabir Mirpuri |
2022-11-29 |
| 11456188 |
Method of making flexible semiconductor device with graphene tape |
Meng Kong Lye, Zhijie Wang |
2022-09-27 |
| 11171077 |
Semiconductor device with lead frame that accommodates various die sizes |
Meng Kong Lye, Zhijie Wang |
2021-11-09 |
| 10692802 |
Flexible semiconductor device with graphene tape |
Meng Kong Lye, Zhijie Wang |
2020-06-23 |
| 10217697 |
Semiconductor device and lead frame with high density lead array |
Zhijie Wang, Zhigang Bai, Meng Kong Lye |
2019-02-26 |
| 10041195 |
Woven signal-routing substrate for wearable electronic devices |
Meng Kong Lye, Zhijie Wang |
2018-08-07 |
| 9548255 |
IC package having non-horizontal die pad and flexible substrate therefor |
Meng Kong Lye, Zhijie Wang |
2017-01-17 |
| 9484289 |
Semiconductor device with heat spreader |
Meng Kong Lye, Penglin Mei |
2016-11-01 |
| 9449901 |
Lead frame with deflecting tie bar for IC package |
Zhijie Wang, Zhigang Bai, Meng Kong Lye |
2016-09-20 |
| 9379035 |
IC package having non-horizontal die pad and lead frame therefor |
Meng Kong Lye, Zhijie Wang |
2016-06-28 |
| 9355945 |
Semiconductor device with heat-dissipating lead frame |
Meng Kong Lye, Zhijie Wang |
2016-05-31 |
| 9196576 |
Semiconductor package with stress relief and heat spreader |
Kai Yun Yow, Poh Leng Eu, Meng Kong Lye, Penglin Mei |
2015-11-24 |
| 9190343 |
Semiconductor device with tube based heat spreader |
Meng Kong Lye, Zhijie Wang |
2015-11-17 |
| 8980690 |
Lead frame based semiconductor device with routing substrate |
Penglin Mei, Meng Kong Lye |
2015-03-17 |
| 8901722 |
Semiconductor device with integral heat sink |
Meng Kong Lye, Penglin Mei |
2014-12-02 |
| 8643153 |
Semiconductor device with staggered leads |
Shunan Qiu, Zhigang Bai, Xuesong Xu, Beiyue Yan |
2014-02-04 |