Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984408 | Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation | You Ge, Zhijie Wang, Yit Meng Lee | 2024-05-14 |
| 11923275 | Lead-frame assembly, semiconductor package and methods for improved adhesion | Allen Marfil Descartin, Jun Li | 2024-03-05 |
| 10847449 | Lead frame with selective patterned plating | Meijiang Song, Allen Marfil Descartin, Lidong Zhang, Jun Li | 2020-11-24 |
| 10734327 | Lead reduction for improved creepage distance | Burton J. Carpenter, Jinmei Liu, Yit Meng Lee, Allen Marfil Descartin | 2020-08-04 |
| 10734311 | Hybrid lead frame for semiconductor die package with improved creepage distance | Burton J. Carpenter, Lidong Zhang, Kendall D. Phillips, Quan Chen, Meng Kong Lye | 2020-08-04 |
| 10446476 | Packaged integrated circuit having stacked die and method for therefor | Leo M. Higgins, III, Fred T. Brauchler, Burton J. Carpenter, Jinmei Liu, Jinzhong Yao +3 more | 2019-10-15 |
| 10151658 | Pressure-sensing integrated circuit device with diaphragm | Allen Marfil Descartin, Alexander M. Arayata | 2018-12-11 |
| 9190353 | Lead frame and substrate semiconductor package | Allen Marfil Descartin, Bo Li | 2015-11-17 |