Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784112 | Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package | JIAN-CHAO SONG, Jun Li, Xingshou Pang, Mingchuan Han, Xuesong Xu | 2023-10-10 |
| 11417541 | Protection from metal migration on IC packages | Zhigang Bai, Xingshou Pang | 2022-08-16 |
| 10515880 | Lead frame with bendable leads | Zhigang Bai, Xingshou Pang, Meng Kong Lye, Xuesong Xu | 2019-12-24 |
| 10446476 | Packaged integrated circuit having stacked die and method for therefor | Leo M. Higgins, III, Fred T. Brauchler, Burton J. Carpenter, Jinmei Liu, Mariano Layson Ching, Jr. +3 more | 2019-10-15 |
| 10290593 | Method of assembling QFP type semiconductor device | Zhigang Bai, Zhijie Wang | 2019-05-14 |
| 10217700 | Lead frame for integrated circuit device having J-leads and Gull Wing leads | Zhigang Bai, Xingshou Pang, Jun Li, Meng Kong Lye | 2019-02-26 |
| 10181434 | Lead frame for integrated circuit device having J-leads and gull wing leads | Xingshou Pang, Zhigang Bai, Meng Kong Lye | 2019-01-15 |
| 10037935 | Lead frame with dummy leads for burr mitigation during encapsulation | Xingshou Pang, Zhigang Bai, Yuan Zang | 2018-07-31 |
| 9890034 | Cavity type pressure sensor device | Zhigang Bai, Zhijie Wang | 2018-02-13 |
| 9589928 | Combined QFN and QFP semiconductor package | Zhigang Bai, Lan Chu Tan | 2017-03-07 |
| 9443746 | Floating mold tool for semicondcutor packaging | Zhigang Bai, Xingshou Pang | 2016-09-13 |
| 9362211 | Exposed pad integrated circuit package with mold lock | Wei Gao, Zhiwei Gong, Yanting Tian, Dehong Ye | 2016-06-07 |
| 9324637 | Quad flat non-leaded semiconductor package with wettable flank | Zhigang Bai, Xingshou Pang, Nan Xu | 2016-04-26 |
| 9214447 | Non-leaded type semiconductor package and method of assembling same | Zhigang Bai, Zhijie Wang | 2015-12-15 |
| 9190351 | Semiconductor device with webbing between leads | Zhigang Bai, Hui Teng Wang | 2015-11-17 |
| 8901721 | Lead frame based semiconductor die package | Zhigang Bai, Yuan Zang | 2014-12-02 |
| 8859336 | Method of packaging semiconductor die with cap element | Junhua Luo, Zhigang Bai, Nan Xu | 2014-10-14 |
| 8859339 | Mold chase | Zhigang Bai | 2014-10-14 |
| 8802474 | Pressure sensor and method of packaging same | Wai Yew Lo, Lan Chu Tan, Xuesong Xu | 2014-08-12 |
| 8722465 | Method of assembling semiconductor device including insulating substrate and heat sink | Junhua Luo, Baoguan Yin | 2014-05-13 |
| 8716846 | Pressure sensor and method of packaging same | Wai Yew Lo, Lan Chu Tan, Xuesong Xu | 2014-05-06 |
| 8709875 | Power device and method of packaging same | Zhigang Bai, Xuesong Xu | 2014-04-29 |
| 8643170 | Method of assembling semiconductor device including insulating substrate and heat sink | Junhua Luo, Baoguan Yin | 2014-02-04 |
| 8525311 | Lead frame for semiconductor device | Zhigang Bai, Xuesong Xu | 2013-09-03 |
| 8481369 | Method of making semiconductor package with improved standoff | Junhua Luo, Xingshou Pang | 2013-07-09 |