Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861828 | Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof | Swain Hong Yeo | 2020-12-08 |
| 10418343 | Package-in-package structure for semiconductor devices and methods of manufacture | Swain Hong Yeo | 2019-09-17 |
| 9190351 | Semiconductor device with webbing between leads | Zhigang Bai, Jinzhong Yao | 2015-11-17 |
| 9111772 | Electronic array and chip package | Volker Strutz, Horst Theuss, Chee Voon Tan | 2015-08-18 |
| 8916958 | Semiconductor package with multiple chips and substrate in metal cap | Chong Tong | 2014-12-23 |
| 8207037 | Method for manufacturing a semiconductor component that includes a field plate | Gennadiy Nemtsev, Yingping Zheng, Gordon M. Grivna | 2012-06-26 |
| 6897561 | Semiconductor power device having a diamond shaped metal interconnect scheme | Gennadiy Nemtsev, Yingping Zheng, Rajesh S. Nair | 2005-05-24 |