Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381381 | Sensor devices with busbar and sensor chip and dielectrics arranged therebetween | Rainer Markus Schaller, Ronak Kalhor-Witzel, Hansjoerg Walter Kuemmel | 2025-08-05 |
| 12366615 | Current sensor that includes a current rail and a magnetic field sensor with galvanic isolation | Rainer Markus Schaller, Jochen Dangelmaier | 2025-07-22 |
| 11895930 | Current sensor package with continuous insulation | Rainer Markus Schaller | 2024-02-06 |
| 11835600 | Current sensor | Rainer Markus Schaller, Jochen Dangelmaier | 2023-12-05 |
| 11726148 | Sensor devices having soft magnets and associated production methods | Rainer Markus Schaller | 2023-08-15 |
| 11662232 | Sensor package and method for producing a sensor package | Rainer Markus Schaller | 2023-05-30 |
| 11561245 | Sensor apparatuses with a bypass current path and associated production methods | Klaus Elian, Rainer Markus Schaller | 2023-01-24 |
| 11493538 | Sensor devices with sensor chip and busbar | Rainer Markus Schaller, Juergen Hoegerl | 2022-11-08 |
| 11391791 | Sensor device with auxiliary structure for calibrating the sensor device | Gernot Binder, Riccardo Dapretto, Diego LUNARDINI, Mario Motz | 2022-07-19 |
| 11385301 | Sensor devices having a sensor chip and busbar | Juergen Hoegerl, Rainer Markus Schaller | 2022-07-12 |
| 11326910 | Sensor package and method for producing a sensor package | Rainer Markus Schaller | 2022-05-10 |
| 11211551 | Current sensor package with continuous insulation | Rainer Markus Schaller | 2021-12-28 |
| 11094619 | Package with component connected with carrier via spacer particles | Manfred Schindler, Franz-Peter Kalz | 2021-08-17 |
| 10515879 | Package with component connected at carrier level | Manfred Schindler, Klaus Elian, Horst Theuss, Michael Weber | 2019-12-24 |
| 10505102 | Semiconductor device for sensing a magnetic field including an encapsulation material defining a through-hole | Klaus Elian, Cyrus Ghahremani, Rainer Markus Schaller | 2019-12-10 |
| 10438878 | Package with component connected with carrier via spacer particles | Manfred Schindler, Franz-Peter Kalz | 2019-10-08 |
| 10304795 | Semiconductor device including antistatic die attach material | Rainer Markus Schaller, Franz-Peter Kalz | 2019-05-28 |
| 9741677 | Semiconductor device including antistatic die attach material | Rainer Markus Schaller, Franz-Peter Kalz | 2017-08-22 |
| 9728493 | Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the same | Rainer Markus Schaller | 2017-08-08 |
| 9658296 | Current sensor device | Udo Ausserlechner, Jochen Dangelmaier, Rainer Steiner | 2017-05-23 |
| 9608201 | Semiconductor devices having insulating substrates and methods of formation thereof | Carsten von Koblinski, Manfred Engelhardt | 2017-03-28 |
| 9553208 | Current sensor device | Gottfried Beer, Horst Theuss | 2017-01-24 |
| 9523720 | Multiple current sensor device, a multiple current shunt device and a method for providing a sensor signal | Udo Ausserlechner | 2016-12-20 |
| 9504143 | Electrical circuit | Wolfgang Scherr | 2016-11-22 |
| 9391263 | Semiconductor devices having insulating substrates and methods of formation thereof | Carsten von Koblinski, Manfred Engelhardt | 2016-07-12 |