Issued Patents All Time
Showing 1–25 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322451 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Juergen Hoegerl, Magdalena Hoier, Georg Meyer-Berg | 2022-05-03 |
| 10957671 | Method for fabricating a semiconductor and semiconductor package | Irmgard Escher-Poeppel | 2021-03-23 |
| 10651898 | Vertical ferrite antenna including pre-fabricated connection members | Walther Pachler, Juergen Hoelzl, Juergen Schilling, Harald Witschnig | 2020-05-12 |
| 10643971 | Method for fabricating a semiconductor and semiconductor package | Irmgard Escher-Poeppel | 2020-05-05 |
| 10522433 | Laminate package of chip on carrier and in cavity | Juergen Hoegerl, Horst Theuss | 2019-12-31 |
| 10438926 | Method for fabricating a semiconductor and semiconductor package | Irmgard Escher-Poeppel | 2019-10-08 |
| 10295570 | Current sensor device having a sense resistor in a re-distribution layer | Wolfgang Furtner | 2019-05-21 |
| 10241088 | Photo-acoustic gas sensor module having light emitter and detector units | Horst Theuss, Sebastian Beer, Alfons Dehe, Franz Jost, Stefan Kolb +2 more | 2019-03-26 |
| 10211158 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Juergen Hoegerl, Magdalena Hoier, Georg Meyer-Berg | 2019-02-19 |
| 10102967 | Method of manufacturing an inductor core for a chip assembly and chip assembly | Bernhard Knott, Rainer Leuschner | 2018-10-16 |
| 10090251 | Semiconductor chip having a dense arrangement of contact terminals | Peter Ossimitz, Juergen Hoegerl, Andreas Munding | 2018-10-02 |
| 10008470 | Embedded chip packages and methods for manufacturing an embedded chip package | Walter Hartner | 2018-06-26 |
| 9984928 | Method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Olaf Hohlfeld, Edward Fuergut, Juergen Hoegerl, Peter Kanschat | 2018-05-29 |
| 9978720 | Insulated die | Horst Theuss, Juergen Hoegerl | 2018-05-22 |
| 9859251 | Semiconductor device having a chip under package | Peter Ossimitz | 2018-01-02 |
| 9818730 | Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement | Irmgard Escher-Poeppel, Juergen Hoegerl, Olaf Hohlfeld, Peter Kanschat | 2017-11-14 |
| 9721920 | Embedded chip packages and methods for manufacturing an embedded chip package | Walter Hartner | 2017-08-01 |
| 9711462 | Package arrangement including external block comprising semiconductor material and electrically conductive plastic material | Dominic Maier, Ulrich Wachter, Daniel Kehrer | 2017-07-18 |
| 9620457 | Semiconductor device packaging | Ulrich Wachter, Eva Wagner | 2017-04-11 |
| 9620459 | Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement | Irmgard Escher-Poeppel, Juergen Hoegerl, Olaf Hohlfeld, Peter Kanschat | 2017-04-11 |
| 9589859 | Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Edward Fuergut, Juergen Hoegerl, Olaf Hohlfeld, Peter Kanschat | 2017-03-07 |
| 9553208 | Current sensor device | Volker Strutz, Horst Theuss | 2017-01-24 |
| 9496237 | Semiconductor device having solderable and bondable electrical contact pads | Raimund Foerg, Juergen Hoegerl | 2016-11-15 |
| 9390973 | On-chip RF shields with backside redistribution lines | Hans-Joachim Barth, Jens Pohl, Heinrich Koerner | 2016-07-12 |
| 9384437 | Smart card module, smart card body, smart card and smart card production method | Frank Pueschner, Thomas Spoettl, Jens Pohl | 2016-07-05 |