Issued Patents All Time
Showing 51–75 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8338936 | Semiconductor device and manufacturing method | Klaus Pressel | 2012-12-25 |
| 8334202 | Device fabricated using an electroplating process | Jens Pohl, Hans-Joachim Barth, Rainer Steiner, Werner Robl, Mathias Vaupel | 2012-12-18 |
| 8330274 | Semiconductor structure and method for making same | Hans-Joachim Barth, Joern Plagmann, Jens Pohl, Werner Robl, Rainer Steiner +1 more | 2012-12-11 |
| 8318540 | Method of manufacturing a semiconductor structure | — | 2012-11-27 |
| 8258624 | Method for fabricating a semiconductor and semiconductor package | Irmgard Escher-Poeppel | 2012-09-04 |
| 8237259 | Embedded chip package | Klaus Pressel | 2012-08-07 |
| 8216881 | Method for fabricating a semiconductor and semiconductor package | Irmgard Escher-Poeppel | 2012-07-10 |
| 8212344 | Microelectromechanical semiconductor component with cavity structure and method for producing the same | Horst Theuss | 2012-07-03 |
| 8169059 | On-chip RF shields with through substrate conductors | Hans-Joachim Barth, Jens Pohl, Oliver Nagy | 2012-05-01 |
| 8148257 | Semiconductor structure and method for making same | Hans-Joachim Barth, Joern Plagmann, Jens Pohl, Werner Robl, Rainer Steiner +1 more | 2012-04-03 |
| 8119452 | Method of fabricating a semiconductor device | Irmgard Escher-Poeppel | 2012-02-21 |
| 8076784 | Stacked semiconductor chips | Markus Brunnbauer, Recai Sezi, Thorsten Meyer | 2011-12-13 |
| 8072071 | Semiconductor device including conductive element | Rainer Steiner, Jens Pohl, Werner Robl, Markus Brunnbauer | 2011-12-06 |
| 7952185 | Semiconductor device with hollow structure | Horst Theuss | 2011-05-31 |
| 7936052 | On-chip RF shields with backside redistribution lines | Hans-Joachim Barth, Jens Pohl, Heinrich Koerner | 2011-05-03 |
| 7922093 | Semiconductor chips for TAG applications, devices for mounting the same, and mounting method | Werner Weber | 2011-04-12 |
| 7915082 | Semiconductor device | Manfred Mengel | 2011-03-29 |
| 7910404 | Method of manufacturing a stacked die module | Klaus Pressel | 2011-03-22 |
| 7867878 | Stacked semiconductor chips | Markus Brunnbauer, Recai Sezi, Thorsten Meyer | 2011-01-11 |
| 7863728 | Semiconductor module including components in plastic casing | Christoph Kienmayer, Klaus Pressel, Werner Simbuerger | 2011-01-04 |
| 7858440 | Stacked semiconductor chips | Klaus Pressel | 2010-12-28 |
| 7830026 | Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip | Edward Fuergut | 2010-11-09 |
| 7807506 | Microelectromechanical semiconductor component with cavity structure and method for producing the same | Horst Theuss | 2010-10-05 |
| 7759805 | Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles | Edward Fuergut | 2010-07-20 |
| 7729569 | Optical transmitter and/or receiver assembly comprising a planar optical circuit | Hans-Ludwig Althaus | 2010-06-01 |