Issued Patents All Time
Showing 1–25 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12324186 | Power semiconductor device and method | Philipp Koch, Stephan Pindl, Hans-Joachim Schulze | 2025-06-03 |
| 12261146 | Semiconductor package | Ralf Otremba, Irmgard Escher-Poeppel, Martin Gruber | 2025-03-25 |
| 12237242 | Semiconductor device package comprising a thermal interface material with improved handling properties | Martin Mayer, Alexander Roth, Karina Rott | 2025-02-25 |
| 12218030 | Electronic module comprising a semiconductor package with integrated clip and fastening element | Peter Eibl, Horst Groeninger, Martin Gruber, Christian Kasztelan, Philipp Seng | 2025-02-04 |
| 12218029 | Semiconductor device with improved performance in operation and improved flexibility in the arrangement of power chips | Anton Mauder, Stephan Voss, Martin Gruber | 2025-02-04 |
| 12136623 | Multi-device semiconductor chip with electrical access to devices at either side | Peter Friedrichs, Ralf Otremba, Hans-Joachim Schulze | 2024-11-05 |
| 12125772 | Method of forming a semiconductor package with connection lug | Martin Gruber, Herbert Hopfgartner, Bernd Schmoelzer | 2024-10-22 |
| 12094793 | Package with electrically insulated carrier and at least one step on encapsulant | Chii Shang Hong, Teck Sim Lee, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-09-17 |
| 12080669 | Semiconductor device module having vertical metallic contacts and a method for fabricating the same | Martin Gruber, Petteri Palm, Bernd Schmoelzer, Wolfgang Scholz, Mark A. Thomas | 2024-09-03 |
| 12002739 | Semiconductor device including an embedded semiconductor die | Achim Althaus, Martin Gruber, Marco Mueller, Bernd Schmoelzer, Wolfgang Scholz +1 more | 2024-06-04 |
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Stefan Woetzel, Thai Kee Gan, Chee Hong Lee, Jayaganasan Narayanasamy +1 more | 2024-05-14 |
| 11955407 | Electronic module including a semiconductor package connected to a fluid heatsink | Davide Chiola, Martin Gruber, Wolfram Hable | 2024-04-09 |
| 11942383 | Linear spacer for spacing a carrier of a package | Chii Shang Hong, Teck Sim Lee, Ralf Otremba, Daniel Pedone, Bernd Schmoelzer | 2024-03-26 |
| 11929298 | Molded semiconductor package with dual integrated heat spreaders | Jo Ean Joanna Chye, Ralf Otremba | 2024-03-12 |
| 11876028 | Package with electrically insulated carrier and at least one step on encapsulant | Chii Shang Hong, Teck Sim Lee, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-01-16 |
| 11728250 | Semiconductor package with connection lug | Martin Gruber, Herbert Hopfgartner, Bernd Schmoelzer | 2023-08-15 |
| 11721616 | Semiconductor package with signal distribution element | Stephan Voss, Martin Gruber, Andreas Huerner, Anton Mauder | 2023-08-08 |
| 11715719 | Semiconductor package and method of forming a semiconductor package | Ralf Otremba, Irmgard Escher-Poeppel, Martin Gruber | 2023-08-01 |
| 11688713 | Additive manufacturing of a frontside or backside interconnect of a semiconductor die | Irmgard Escher-Poeppel, Martin Gruber, Ivan Nikitin, Hans-Joachim Schulze | 2023-06-27 |
| 11646258 | Electronic devices including electrically insulated load electrodes | Thomas Basler, Reinhold Bayerer, Ivan Nikitin | 2023-05-09 |
| 11367683 | Silicon carbide device and method for forming a silicon carbide device | Ravi Keshav Joshi, Ralf Siemieniec, Thomas Basler, Martin Gruber, Jochen Hilsenbeck +3 more | 2022-06-21 |
| 11348866 | Package and lead frame design for enhanced creepage and clearance | Thai Kee Gan, Teck Sim Lee, Lee Shuang Wang | 2022-05-31 |
| 11189542 | Method for fabricating an electronic module via compression molding | Dae Kuen Park | 2021-11-30 |
| 11189537 | Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit | Khalil Hosseini, Joachim Mahler | 2021-11-30 |
| 11049790 | Electrically insulating thermal interface on the discontinuity of an encapsulation structure | Manfred Mengel | 2021-06-29 |