Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334414 | Power semiconductor device with dual heat dissipation structures | Jayaganasan Narayanasamy, Angel Enverga, Chee Ming Lam, Sanjay Kumar Murugan, Subaramaniym Senivasan | 2025-06-17 |
| 12094793 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Teck Sim Lee, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-09-17 |
| 12080625 | Semiconductor package with releasable isolation layer protection | Li Fong Chong, Yee Beng Daryl Yeow, Azlina Kassim, Hui Kin Lit | 2024-09-03 |
| 11942383 | Linear spacer for spacing a carrier of a package | Edward Fuergut, Teck Sim Lee, Ralf Otremba, Daniel Pedone, Bernd Schmoelzer | 2024-03-26 |
| 11908771 | Power semiconductor device with dual heat dissipation structures | Jayaganasan Narayanasamy, Angel Enverga, Chee Ming Lam, Sanjay Kumar Murugan, Subaramaniym Senivasan | 2024-02-20 |
| 11876028 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Teck Sim Lee, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-01-16 |
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Ralf Otremba, Jo Ean Joanna Chye, Teck Sim Lee, Hui Kin Lit, Ke Yan Tean +2 more | 2023-10-31 |
| 11791238 | Semiconductor package with releasable isolation layer protection | Li Fong Chong, Yee Beng Daryl Yeow, Azlina Kassim, Hui Kin Lit | 2023-10-17 |
| 11289436 | Semiconductor package having a laser-activatable mold compound | Chee Hong Lee, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng, Klaus Schiess | 2022-03-29 |
| 11075185 | Semiconductor package with multi-level conductive clip for top side cooling | Ivan Nikitin, Wei Han Koo, Chiew Li Tai | 2021-07-27 |
| 10978380 | Semiconductor package with multi-level conductive clip for top side cooling | Wei Han Koo, Chiew Li Tai | 2021-04-13 |
| 10971436 | Multi-branch terminal for integrated circuit (IC) package | Thomas Stoek, Chiew Li Tai, Edmund Sales Cabatbat | 2021-04-06 |
| 10840164 | Wire bonded package with single piece exposed heat slug and leads | Edmund Sales Cabatbat, Lee Shuang Wang | 2020-11-17 |
| 10354943 | Multi-branch terminal for integrated circuit (IC) package | Thomas Stoek, Chiew Li Tai, Edmund Sales Cabatbat | 2019-07-16 |