Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218038 | Leadframe, semiconductor package and method | Chau Fatt Chiang, Paul Armand Asentista Calo, Josef Hoeglauer, Swee Kah Lee, Khay Chwan Saw | 2025-02-04 |
| 12150236 | Voltage regulator module with inductor-cooled power stage | Gerald Deboy, Angela Kessler, Kennith Kin Leong, Chee Yang Ng, Luca Peluso | 2024-11-19 |
| 12027436 | Package with clip having through hole accommodating component-related structure | Angela Kessler, Josef Hoeglauer, Chiah Chin Lim, Mei Qi Tay | 2024-07-02 |
| 11289436 | Semiconductor package having a laser-activatable mold compound | Chee Hong Lee, Chii Shang Hong, Swee Kah Lee, Chee Yang Ng, Klaus Schiess | 2022-03-29 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Jo Ean Chye, Chee Hong Lee +4 more | 2022-03-15 |
| 11174152 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Chau Fatt Chiang, Swee Kah Lee, Chee Yang Ng | 2021-11-16 |
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Chau Fatt Chiang, Soon Lock Goh, Swee Kah Lee, Joachim Mahler +3 more | 2021-08-03 |
| 11039231 | Package with acoustic sensing device(s) and millimeter wave sensing elements | Chee Yang Ng | 2021-06-15 |
| 10777536 | Semiconductor package with air cavity | Chau Fatt Chiang, April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin +8 more | 2020-09-15 |
| 10631100 | Micro-electrical mechanical system sensor package and method of manufacture thereof | Chau Fatt Chiang | 2020-04-21 |
| 10501312 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Chau Fatt Chiang, Swee Kah Lee, Chee Yang Ng | 2019-12-10 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Soon Lock Goh, Swee Kah Lee, Joachim Mahler +3 more | 2019-08-27 |
| 10304780 | Device having substrate with conductive pillars | Chau Fatt Chiang, Swee Kah Lee, Chee Yang Ng, Valentyn Solomko | 2019-05-28 |
| 10163812 | Device having substrate with conductive pillars | Chau Fatt Chiang, Swee Kah Lee, Chee Yang Ng, Valentyn Solomko | 2018-12-25 |
| 10155657 | Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening | Matthias Steiert, Chu Hua Goh, Woon Yau Lim, Christina Yeong | 2018-12-18 |
| 9868632 | Molded cavity package with embedded conductive layer and enhanced sealing | Chau Fatt Chiang, Swee Kah Lee, Chee Yang Ng, Horst Theuss | 2018-01-16 |
| 9475691 | Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device | Sook Woon Chan, Chau Fatt Chiang, Stefan Martens, Matthias Steiert, Kian Hong Yeo +3 more | 2016-10-25 |