Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300559 | Semiconductor packages and methods for manufacturing thereof | Si Hao Vincent Yeo, Chan Lam Cha, Ying Dieh Cheong, Chau Fatt Chiang, Cher Hau Danny Koh +7 more | 2025-05-13 |
| 12218038 | Leadframe, semiconductor package and method | Chau Fatt Chiang, Paul Armand Asentista Calo, Kok Yau Chua, Josef Hoeglauer, Swee Kah Lee | 2025-02-04 |
| 12176222 | Semiconductor package with metal posts from structured leadframe | Chau Fatt Chiang, Thorsten Meyer, Chan Lam Cha, Wern Ken Daryl Wee, Chee Hong Lee +2 more | 2024-12-24 |
| 12021000 | Semiconductor package and method for fabricating a semiconductor package | Chau Fatt Chiang, Norliza Morban | 2024-06-25 |
| 11587800 | Semiconductor package with lead tip inspection feature | Chau Fatt Chiang, Chee Voon Tan | 2023-02-21 |
| 11569196 | Chip to chip interconnect in encapsulant of molded semiconductor package | Chau Fatt Chiang, Stefan Macheiner, Wae Chet Yong | 2023-01-31 |
| 11296000 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Norliza Morban, Yong Chern Poh, Si Hao Vincent Yeo | 2022-04-05 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye +4 more | 2022-03-15 |
| 11133281 | Chip to chip interconnect in encapsulant of molded semiconductor package | Chau Fatt Chiang, Stefan Macheiner, Wae Chet Yong | 2021-09-28 |
| 10796981 | Chip to lead interconnect in encapsulant of molded semiconductor package | Chau Fatt Chiang | 2020-10-06 |
| 10741466 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Norliza Morban, Yong Chern Poh, Si Hao Vincent Yeo | 2020-08-11 |
| 10325837 | Molded semiconductor package with C-wing and gull-wing leads | Cher Hau Danny Koh, Hai Sin Chong, Stefan Machiener, Yong Chern Poh, Toni Salminen | 2019-06-18 |