Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296000 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Norliza Morban, Khay Chwan Saw, Si Hao Vincent Yeo | 2022-04-05 |
| 10741466 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Norliza Morban, Khay Chwan Saw, Si Hao Vincent Yeo | 2020-08-11 |
| 10325837 | Molded semiconductor package with C-wing and gull-wing leads | Cher Hau Danny Koh, Hai Sin Chong, Stefan Machiener, Toni Salminen, Khay Chwan Saw | 2019-06-18 |
| 7674657 | Method of manufacture of encapsulated package | Chai Wei Heng, Yang Hong Heng | 2010-03-09 |