Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10813229 | Electronic module having an electrically insulating structure with material having a low modulus of elasticity | Markus Dinkel | 2020-10-20 |
| 10325837 | Molded semiconductor package with C-wing and gull-wing leads | Cher Hau Danny Koh, Hai Sin Chong, Stefan Machiener, Yong Chern Poh, Khay Chwan Saw | 2019-06-18 |
| 10168391 | Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto | Giuliano Angelo Babulano, Jens Oetjen, Liu Chen, Stefan Mieslinger, Markus Dinkel +4 more | 2019-01-01 |
| 9681558 | Module with integrated power electronic circuitry and logic circuitry | Liu Chen, Markus Dinkel | 2017-06-13 |
| 9564423 | Power package with integrated magnetic field sensor | Liu Chen, Stefan Mieslinger, Giuliano Angelo Babulano, Jens Oetjen, Markus Dinkel +1 more | 2017-02-07 |
| 9564578 | Semiconductor package with integrated magnetic field sensor | Thorsten Meyer, Martin Gruber, Rainer Markus Schaller, Franz Jost, Stefan Mieslinger +4 more | 2017-02-07 |