Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10168391 | Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto | Giuliano Angelo Babulano, Liu Chen, Toni Salminen, Stefan Mieslinger, Markus Dinkel +4 more | 2019-01-01 |
| 10121753 | Enhanced solder pad | Stefan Macheiner | 2018-11-06 |
| 9564423 | Power package with integrated magnetic field sensor | Liu Chen, Toni Salminen, Stefan Mieslinger, Giuliano Angelo Babulano, Markus Dinkel +1 more | 2017-02-07 |
| 9564578 | Semiconductor package with integrated magnetic field sensor | Thorsten Meyer, Martin Gruber, Rainer Markus Schaller, Franz Jost, Stefan Mieslinger +4 more | 2017-02-07 |
| 7265564 | Method for testing a contact region of a semiconductor module | Ralf Otremba, Josef Höglauer, Christian Musshoff | 2007-09-04 |