Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394697 | Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw | Thorsten Scharf, Thomas Bemmerl, Thorsten Meyer, Frank Singer | 2025-08-19 |
| 12261146 | Semiconductor package | Edward Fuergut, Ralf Otremba, Irmgard Escher-Poeppel | 2025-03-25 |
| 12218029 | Semiconductor device with improved performance in operation and improved flexibility in the arrangement of power chips | Edward Fuergut, Anton Mauder, Stephan Voss | 2025-02-04 |
| 12218030 | Electronic module comprising a semiconductor package with integrated clip and fastening element | Edward Fuergut, Peter Eibl, Horst Groeninger, Christian Kasztelan, Philipp Seng | 2025-02-04 |
| 12165959 | Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method | Frank Singer, Marcus Boehm, Andreas Grassmann, Uwe Schindler | 2024-12-10 |
| 12154886 | Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof | Thorsten Meyer, Thorsten Scharf | 2024-11-26 |
| 12125772 | Method of forming a semiconductor package with connection lug | Edward Fuergut, Herbert Hopfgartner, Bernd Schmoelzer | 2024-10-22 |
| 12080669 | Semiconductor device module having vertical metallic contacts and a method for fabricating the same | Edward Fuergut, Petteri Palm, Bernd Schmoelzer, Wolfgang Scholz, Mark A. Thomas | 2024-09-03 |
| 12002739 | Semiconductor device including an embedded semiconductor die | Edward Fuergut, Achim Althaus, Marco Mueller, Bernd Schmoelzer, Wolfgang Scholz +1 more | 2024-06-04 |
| 11955415 | Semiconductor device package comprising a pin in the form of a drilling screw | Thorsten Scharf, Thomas Bemmerl, Thorsten Meyer, Frank Singer | 2024-04-09 |
| 11955407 | Electronic module including a semiconductor package connected to a fluid heatsink | Edward Fuergut, Davide Chiola, Wolfram Hable | 2024-04-09 |
| 11915999 | Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element | Tomasz Naeve, Ralf Otremba, Thorsten Scharf, Markus Dinkel, Elvir Kahrimanovic | 2024-02-27 |
| 11862582 | Package with elevated lead and structure extending vertically from encapsulant bottom | Thorsten Meyer, Thomas Bemmerl, Martin Richard Niessner | 2024-01-02 |
| 11728250 | Semiconductor package with connection lug | Edward Fuergut, Herbert Hopfgartner, Bernd Schmoelzer | 2023-08-15 |
| 11721616 | Semiconductor package with signal distribution element | Stephan Voss, Edward Fuergut, Andreas Huerner, Anton Mauder | 2023-08-08 |
| 11715719 | Semiconductor package and method of forming a semiconductor package | Edward Fuergut, Ralf Otremba, Irmgard Escher-Poeppel | 2023-08-01 |
| 11710684 | Package with separate substrate sections | Frank Singer, Thorsten Meyer, Thorsten Scharf, Peter Strobel, Stefan Woetzel | 2023-07-25 |
| 11688713 | Additive manufacturing of a frontside or backside interconnect of a semiconductor die | Edward Fuergut, Irmgard Escher-Poeppel, Ivan Nikitin, Hans-Joachim Schulze | 2023-06-27 |
| 11600558 | Plurality of transistor packages with exposed source and drain contacts mounted on a carrier | Tomasz Naeve, Ralf Otremba, Thorsten Scharf, Markus Dinkel, Elvir Kahrimanovic | 2023-03-07 |
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Josef Hoeglauer, Michael Juerss, Josef Maerz +3 more | 2022-11-29 |
| 11502042 | Processing of one or more carrier bodies and electronic components by multiple alignment | Thorsten Meyer, Thomas Behrens, Thorsten Scharf, Peter Strobel | 2022-11-15 |
| 11367683 | Silicon carbide device and method for forming a silicon carbide device | Edward Fuergut, Ravi Keshav Joshi, Ralf Siemieniec, Thomas Basler, Jochen Hilsenbeck +3 more | 2022-06-21 |
| 11325676 | Electric drive device for a bicycle | Reinhold Gruber | 2022-05-10 |
| 11264356 | Batch manufacture of packages by sheet separated into carriers after mounting of electronic components | Thorsten Meyer, Thomas Behrens, Andreas Grassmann, Thorsten Scharf | 2022-03-01 |
| 10989742 | Magnetic current sensor | Anton Mauder, Goran Keser | 2021-04-27 |