Issued Patents All Time
Showing 1–25 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237246 | Semiconductor devices including parallel electrically conductive layers | Petteri Palm, Robert Fehler, Angela Kessler | 2025-02-25 |
| 12218038 | Leadframe, semiconductor package and method | Chau Fatt Chiang, Paul Armand Asentista Calo, Kok Yau Chua, Swee Kah Lee, Khay Chwan Saw | 2025-02-04 |
| 12205919 | Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module | Chuan Cheah, Tobias Polster | 2025-01-21 |
| 12087740 | Method of forming a semiconductor module | Angela Kessler, Gerhard Noebauer | 2024-09-10 |
| 12027436 | Package with clip having through hole accommodating component-related structure | Angela Kessler, Kok Yau Chua, Chiah Chin Lim, Mei Qi Tay | 2024-07-02 |
| 11996771 | Power semiconductor system having an inductor module attached to a power stage module | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2024-05-28 |
| 11978692 | Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor module | Sergey Yuferev, Gerhard Noebauer, Hao Zhuang | 2024-05-07 |
| 11817430 | Semiconductor module | Angela Kessler, Gerhard Noebauer | 2023-11-14 |
| 11776882 | Method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Eung San Cho, Ralf Otremba, Fabian Schnoy | 2023-10-03 |
| 11539291 | Method of manufacturing a power semiconductor system | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2022-12-27 |
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Michael Juerss, Josef Maerz +3 more | 2022-11-29 |
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Eung San Cho, Ralf Otremba, Fabian Schnoy | 2022-04-12 |
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Thorsten Scharf, Martin Gruber, Michael Juerss, Josef Maerz, Thorsten Meyer +1 more | 2021-03-30 |
| 10903133 | Method of producing an SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Uwe Kirchner, Guenther Lohmann +2 more | 2021-01-26 |
| 10833583 | Methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2020-11-10 |
| 10700037 | Reinforcement for electrical connectors | Eung San Cho, Thorsten Meyer, Xaver Schloegel, Thomas Behrens | 2020-06-30 |
| 10699987 | SMD package with flat contacts to prevent bottleneck | Ralf Otremba, Chooi Mei Chong, Markus Dinkel, Klaus Schiess, Xaver Schloegel | 2020-06-30 |
| 10601314 | Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2020-03-24 |
| 10566260 | SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Uwe Kirchner, Guenther Lohmann +2 more | 2020-02-18 |
| 10224912 | Half bridge circuit, method of operating a half bridge circuit and a half bridge circuit package | Ralf Otremba, Gerhard Noebauer | 2019-03-05 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Amirul Afiq Hud, Chooi Mei Chong, Klaus Schiess, Lee Shuang Wang +3 more | 2019-02-12 |
| 9991183 | Semiconductor component having inner and outer semiconductor component housings | Teck Sim Lee, Ralf Otremba, Klaus Schiess, Xaver Schloegel, Juergen Schredl | 2018-06-05 |
| 9824958 | Chip carrier structure, chip package and method of manufacturing the same | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2017-11-21 |
| 9806029 | Transistor arrangement with semiconductor chips between two substrates | Ralf Otremba, Chooi Mei Chong | 2017-10-31 |
| 9786584 | Lateral element isolation device | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2017-10-10 |