Issued Patents All Time
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431367 | Embedded package with shielding pad | Robert Fehler, Kushal Kshirsagar, Emanuele Bodano, Martin Benisek | 2025-09-30 |
| 12237246 | Semiconductor devices including parallel electrically conductive layers | Petteri Palm, Robert Fehler, Josef Hoeglauer | 2025-02-25 |
| 12150236 | Voltage regulator module with inductor-cooled power stage | Gerald Deboy, Kok Yau Chua, Kennith Kin Leong, Chee Yang Ng, Luca Peluso | 2024-11-19 |
| 12131988 | Semiconductor package and passive element with interposer | Robert Carroll, Robert Fehler | 2024-10-29 |
| 12087740 | Method of forming a semiconductor module | Josef Hoeglauer, Gerhard Noebauer | 2024-09-10 |
| 12033909 | Die package and method of manufacturing a die package | Petteri Palm | 2024-07-09 |
| 12027436 | Package with clip having through hole accommodating component-related structure | Kok Yau Chua, Josef Hoeglauer, Chiah Chin Lim, Mei Qi Tay | 2024-07-02 |
| 12009290 | Semiconductor module having a multi-branch switch node connector | Sergey Yuferev, Robert Fehler, Gerhard Noebauer, Petteri Palm | 2024-06-11 |
| 11848262 | Semiconductor package and passive element with interposer | Robert Carroll, Robert Fehler | 2023-12-19 |
| 11817430 | Semiconductor module | Josef Hoeglauer, Gerhard Noebauer | 2023-11-14 |
| 11664304 | Semiconductor module | Sergey Yuferev, Robert Fehler, Gerhard Noebauer, Petteri Palm | 2023-05-30 |
| 11056458 | Package comprising chip contact element of two different electrically conductive materials | Andreas Grassmann | 2021-07-06 |
| 10615097 | Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2020-04-07 |
| 10586756 | Chip carrier configured for delamination-free encapsulation and stable sintering | Alexander Roth, Andreas Grassmann, Juergen Hoegerl | 2020-03-10 |
| 10283432 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Wolfram Hable, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2019-05-07 |
| 10242969 | Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same | Olaf Hohlfeld, Juergen Hoegerl, Magdalena Hoier | 2019-03-26 |
| 10211133 | Package with interconnections having different melting temperatures | Andreas Grassmann, Juergen Hoegerl, Ivan Nikitin | 2019-02-19 |
| 10128180 | Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages | Michael Bauer, Alfred Haimerl, Wolfgang Schober | 2018-11-13 |
| 10074590 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Wolfram Hable, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2018-09-11 |
| 10062671 | Circuit board embedding a power semiconductor chip | Martin Gruber, Thorsten Scharf | 2018-08-28 |
| 9859198 | Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages | Michael Bauer, Alfred Haimerl, Wolfgang Schober | 2018-01-02 |
| 9633927 | Chip arrangement and method for producing a chip arrangement | Joachim Mahler, Alfred Haimerl, Michael Bauer | 2017-04-25 |
| 9536816 | Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure | Eduard Knauer, Rudolf Lehner, Wolfgang Schober, Sigrid Schultes | 2017-01-03 |
| 9263425 | Semiconductor device including multiple semiconductor chips and a laminate | Thorsten Scharf, Petteri Palm | 2016-02-16 |
| 9140735 | Integration of current measurement in wiring structure of an electronic circuit | Martin Gruber | 2015-09-22 |