Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322451 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Juergen Hoegerl, Gottfried Beer, Georg Meyer-Berg | 2022-05-03 |
| 10242969 | Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same | Olaf Hohlfeld, Juergen Hoegerl, Angela Kessler | 2019-03-26 |
| 10211158 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Juergen Hoegerl, Gottfried Beer, Georg Meyer-Berg | 2019-02-19 |
| 9924594 | Power semiconductor module and method for producing a power semiconductor module | Andre Arens, Juergen Hoegerl | 2018-03-20 |
| 9780053 | Method of forming a bondpad and bondpad | Peter Scherl, Manfred Schneegans | 2017-10-03 |
| 9756726 | Electronic device and method of fabricating an electronic device | Alexander Heinrich, Peter Scherl, Hans-Joerg Timme | 2017-09-05 |
| 9196510 | Semiconductor package comprising two semiconductor modules and laterally extending connectors | Olaf Hohlfeld, Juergen Hoegerl, Gottfried Beer | 2015-11-24 |